AX1000-1FGG896M

IC FPGA 516 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 896-BGA

Quantity 946 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FGG896M – Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 896-BGA

The AX1000-1FGG896M is a member of Microchip Technology’s Axcelerator antifuse FPGA family using the AX architecture. This single-chip, nonvolatile FPGA delivers 1,000,000 equivalent system gates with 18,144 logic elements and embedded memory to support high-performance, security-conscious designs.

Designed for applications that require deterministic timing, embedded FIFOs, and high-speed I/O, the device targets markets where military-grade operating range and on-chip nonvolatile configuration are required. Key value propositions include high internal performance, flexible multi-standard I/Os, and on-chip embedded memory and PLL resources for system-level integration.

Key Features

  • Core Capacity — 1,000,000 equivalent system gates and 18,144 logic elements provide substantial logic density for complex functions and system integration.
  • Embedded Memory — 165,888 total RAM bits (approximately 0.166 Mbits) organized in configurable RAM/FIFO blocks with embedded FIFO control logic for packet buffering and data staging.
  • I/O Resources — 516 user I/Os with support for multi-standard operation including LVDS-capable interfaces (700 Mb/s LVDS capable), differential and single-ended standards, and bank-selectable mixed-voltage operation.
  • Performance — Family-level capabilities include 350+ MHz system performance and 500+ MHz internal performance, plus high-performance embedded FIFOs and PLL frequency synthesis capabilities up to 1 GHz.
  • Clocking & Timing — Segmentable clock resources and embedded PLLs with a 14–200 MHz input range allow flexible clock management and deterministic, user-controllable timing.
  • Nonvolatile Security — Antifuse, single-chip nonvolatile architecture with FuseLock programming technology to help protect design IP and resist reverse engineering.
  • Package & Mounting — Surface-mount 896-BGA package; supplier device package listed as 896-FBGA (31×31), suitable for high-density board integration.
  • Supply & Temperature — Core voltage supply range 1.425 V to 1.575 V and military-grade operating temperature from −55 °C to 125 °C for deployment in demanding environments.
  • Standards & Testability — Boundary-scan (JTAG) support for board-level test and in-system diagnostic and debug capability with Microchip Silicon Explorer II.

Typical Applications

  • Military and Defense Systems — Military-grade temperature range (−55 °C to 125 °C) and nonvolatile antifuse architecture with FuseLock provide a secure, rugged solution for defense electronics.
  • High-Speed Data Interfaces — LVDS-capable I/Os and embedded FIFOs support high-throughput serial links and data acquisition buffering at hundreds of megabits per second.
  • Deterministic Embedded Systems — Segmentable clock resources, embedded PLLs, and deterministic timing make the device suitable for real-time processing and control applications that require predictable latency.
  • System Integration and IP Protection — Single-chip nonvolatile configuration reduces external boot components and FuseLock technology helps protect proprietary logic and designs.

Unique Advantages

  • High Logic Density: One million equivalent gates and 18,144 logic elements enable consolidation of multiple functions onto a single FPGA, reducing board-level complexity.
  • Embedded Memory & FIFOs: Approximately 0.166 Mbits of on-chip RAM with programmable FIFO control improves data buffering and reduces dependence on external memory.
  • Multi-Standard I/O Flexibility: Bank-selectable mixed-voltage I/Os and support for differential standards such as LVDS enable interfacing with a wide range of peripherals and link technologies.
  • Nonvolatile, Secure Configuration: Antifuse technology and FuseLock programming protect designs against reverse engineering while eliminating configuration storage requirements at power-up.
  • Rugged Operating Range: Military-grade temperature specification (−55 °C to 125 °C) expands suitability for harsh-environment deployments.
  • Deterministic Timing and Clocking: Segmentable clocks and embedded PLLs provide precise clock management for timing-critical system designs.

Why Choose AX1000-1FGG896M?

AX1000-1FGG896M combines high gate count, substantial logic element capacity, and embedded RAM/FIFO resources in a single, nonvolatile antifuse FPGA tailored for secure, high-performance systems. Its multi-standard I/O flexibility and deterministic clocking features make it a practical choice for designs that require high-throughput interfaces and controlled timing behavior.

This device is well suited to customers building rugged, secure systems who need on-chip memory, embedded clocking and PLLs, and military-grade temperature performance. The Axcelerator architecture and FuseLock programming technology provide long-term robustness and IP protection for deployed designs.

Request a quote or submit an inquiry to discuss availability, pricing, and integration support for AX1000-1FGG896M. Our team can provide technical details and assist with qualification and procurement steps.

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