AX1000-1FGG484
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA |
|---|---|
| Quantity | 539 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-1FGG484 – Axcelerator FPGA, 484-FPBGA
The AX1000-1FGG484 is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX antifuse architecture. It delivers a one-million-gate equivalent fabric with on-chip SRAM and embedded FIFO control logic, targeting high-performance, single-chip nonvolatile implementations.
Designed for applications requiring dense logic, high I/O count and deterministic timing, this commercial-grade device combines segmentable clocks, PLLs and flexible multi-standard I/Os with a low-voltage core supply for compact, high-throughput designs.
Key Features
- Core Capacity Approximately 1,000,000 equivalent system gates and 18,144 logic elements for complex logic integration and high resource utilization.
- Embedded Memory Contains 165,888 total RAM bits—approximately 0.166 Mbits—organized as multiple core RAM blocks with programmable FIFO control logic for buffering and data-path acceleration.
- I/O and Interfaces 317 user I/Os with bank-selectable, multi-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for differential and single-ended standards, including LVDS and LVPECL; LVDS I/Os are specified for 700 Mb/s capability.
- Performance and Timing Architecture supports 350+ MHz system performance and 500+ MHz internal performance, plus segmentable clock resources and embedded PLLs for flexible clock synthesis and deterministic timing.
- Nonvolatile Antifuse Technology CMOS antifuse process (0.15 μm, seven metal layers) provides a single-chip, nonvolatile solution suitable for applications that require one-time programmable configuration and design security.
- Power and Supply Core supply range 1.425 V to 1.575 V for low-voltage operation; I/O banks support mixed-voltage interfacing to reduce level-shifting requirements.
- Package and Mounting 484-FPBGA (23×23) package, 484-BGA case, surface-mount mounting for dense PCB layouts.
- Commercial Grade Rated for operation from 0 °C to 70 °C and RoHS-compliant.
- Design Security and Test Includes FuseLock programming technology for protection against reverse engineering and supports boundary-scan (IEEE 1149.1) and Microchip Silicon Explorer II for in-system diagnostics and debug.
Typical Applications
- High-Speed Communications Use as protocol bridges, serializers/deserializers and data-path controllers where LVDS-capable I/Os and high internal throughput are required.
- Network and Telecom Equipment Implement packet processing, buffering and timing-critical functions leveraging embedded FIFOs, PLLs and deterministic timing resources.
- Instrumentation and Test Suitable for measurement and test systems that need dense logic, on-chip RAM for acquisition buffering, and precise clocking.
- Embedded System Integration Consolidate glue logic, peripheral interfacing and custom accelerators on a single nonvolatile device to reduce BOM and board area.
Unique Advantages
- High integration density: One million equivalent gates and 18,144 logic elements allow consolidation of large functions into a single device, simplifying system design.
- On-chip buffering and memory: Approximately 0.166 Mbits of embedded RAM with programmable FIFO control reduces external memory requirements and improves data-path efficiency.
- Flexible I/O signaling: Bank-selectable, mixed-voltage I/Os and high-speed LVDS support enable direct interfacing with a broad range of high-speed transceivers and legacy logic levels.
- Deterministic timing and clocking: Segmentable clocks and embedded PLLs support complex clocking schemes and predictable timing closure for high-speed designs.
- Nonvolatile, secure configuration: Antifuse-based single-chip configuration with FuseLock enhances design security and eliminates the need for external configuration memories.
- Compact surface-mount packaging: 484-FPBGA (23×23) provides a high-pin-count, space-efficient package for dense PCB implementations.
Why Choose AX1000-1FGG484?
The AX1000-1FGG484 positions itself as a high-capacity, nonvolatile FPGA option for designs that require substantial logic resources, high I/O counts and dependable on-chip memory. Its combination of antifuse-based configuration, embedded FIFOs, flexible I/O standards and deterministic clocking makes it well suited for communications, instrumentation and embedded system consolidation.
Engineers seeking a single-chip solution to reduce board-level complexity and protect intellectual property will find the AX1000-1FGG484 delivers a balance of performance, integration and security supported by Microchip’s Axcelerator architecture and diagnostic capabilities.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for the AX1000-1FGG484.

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