AX1000-1FGG484I

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 245 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FGG484I – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

The AX1000-1FGG484I is a member of Microchip Technology’s Axcelerator antifuse FPGA family built on the AX architecture. It provides a single-chip, nonvolatile programmable logic solution with approximately 1,000,000 equivalent system gates and embedded SRAM/FIFO resources for high-performance digital designs.

Designed for systems that require deterministic timing, on-chip memory and flexible I/O, this device delivers high internal and system performance, multi-standard I/O support and in-system diagnostics while operating over an industrial temperature range.

Key Features

  • Core & Architecture AX antifuse architecture offering a nonvolatile, single-chip programmable solution; manufactured on a 0.15 μm CMOS antifuse process with seven metal layers.
  • Performance System performance rated at 350+ MHz with internal performance of 500+ MHz; embedded PLLs support input ranges from 14–200 MHz and frequency synthesis up to 1 GHz.
  • Logic Capacity Approximately 1,000,000 equivalent system gates and 18,144 logic elements to implement complex logic and control functions.
  • Embedded Memory Approximately 0.166 Mbits of embedded SRAM/FIFO (165,888 total bits) with variable-aspect 4,608-bit RAM blocks and embedded FIFO control logic.
  • I/O Flexibility 317 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V), bank-selectable I/Os (8 banks per chip), and high-speed differential interfaces including LVDS and LVPECL; LVDS-capable channels up to 700 Mb/s.
  • Reliability & Security Deterministic, user-controllable timing, IEEE 1149.1 (JTAG) boundary-scan support and FuseLock™ programming technology to protect design IP against reverse engineering.
  • Power & Supply Core supply range 1.425 V to 1.575 V (nominal 1.5 V) for low-power core operation.
  • Package & Thermal 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) surface-mount package rated for industrial operation from −40 °C to 85 °C.
  • Standards & Test Segmentable clock resources, embedded PLLs, and in-system diagnostic/debug capability for development and production testability.

Typical Applications

  • High-speed data transport — Implement interface logic and protocol bridging where high internal performance and LVDS-capable I/Os enable reliable data movement.
  • Communications infrastructure — Use embedded FIFOs, PLLs and deterministic timing to handle packet buffering, clocking and timing in telecom or data-center equipment.
  • Industrial control — Deploy as a deterministic, nonvolatile programmable controller for motor control, sensor aggregation and machine-automation logic across an industrial temperature range.
  • Security-sensitive designs — FuseLock™ programming and antifuse nonvolatile topology support designs with IP protection and reduced risk of reverse engineering.

Unique Advantages

  • Nonvolatile single-chip solution: Eliminates the need for external configuration memory and simplifies system boot and security requirements.
  • High-speed internal performance: 500+ MHz internal performance and on-chip PLL frequency synthesis enable demanding timing and high-throughput datapaths.
  • Flexible mixed-voltage I/Os: Multi-standard I/O support and bank-selectable voltages reduce level-shifter requirements and simplify multi-domain interface designs.
  • Embedded memory with FIFO control: On-chip SRAM and FIFO logic reduce external memory dependencies for buffering and streaming applications.
  • Industrial temperature rating: −40 °C to 85 °C qualification supports deployments in a wide range of industrial environments.
  • Design protection features: FuseLock™ and antifuse technology provide hardware-level protection against reverse engineering and IP theft.

Why Choose AX1000-1FGG484I?

The AX1000-1FGG484I delivers a balance of high logic capacity, embedded memory and flexible I/O packaged in a nonvolatile antifuse FPGA. Its AX architecture and on-chip PLLs provide deterministic timing and frequency synthesis capabilities suitable for demanding digital and mixed-signal edge applications. With industrial-grade temperature limits and hardware IP protection mechanisms, it is suited to engineers who need robust, secure and high-performance programmable logic in a single-chip solution.

Choose this device when you require scalable logic resources, embedded SRAM/FIFO, multi-standard high-speed I/Os and a nonvolatile configuration model that simplifies system design and protects your intellectual property.

Request a quote or submit an inquiry to receive pricing and availability for the AX1000-1FGG484I. Our team can provide lead-time information and help integrate this device into your design.

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