AX1000-1FGG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA |
|---|---|
| Quantity | 245 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-1FGG484I – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA
The AX1000-1FGG484I is a member of Microchip Technology’s Axcelerator antifuse FPGA family built on the AX architecture. It provides a single-chip, nonvolatile programmable logic solution with approximately 1,000,000 equivalent system gates and embedded SRAM/FIFO resources for high-performance digital designs.
Designed for systems that require deterministic timing, on-chip memory and flexible I/O, this device delivers high internal and system performance, multi-standard I/O support and in-system diagnostics while operating over an industrial temperature range.
Key Features
- Core & Architecture AX antifuse architecture offering a nonvolatile, single-chip programmable solution; manufactured on a 0.15 μm CMOS antifuse process with seven metal layers.
- Performance System performance rated at 350+ MHz with internal performance of 500+ MHz; embedded PLLs support input ranges from 14–200 MHz and frequency synthesis up to 1 GHz.
- Logic Capacity Approximately 1,000,000 equivalent system gates and 18,144 logic elements to implement complex logic and control functions.
- Embedded Memory Approximately 0.166 Mbits of embedded SRAM/FIFO (165,888 total bits) with variable-aspect 4,608-bit RAM blocks and embedded FIFO control logic.
- I/O Flexibility 317 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V), bank-selectable I/Os (8 banks per chip), and high-speed differential interfaces including LVDS and LVPECL; LVDS-capable channels up to 700 Mb/s.
- Reliability & Security Deterministic, user-controllable timing, IEEE 1149.1 (JTAG) boundary-scan support and FuseLock™ programming technology to protect design IP against reverse engineering.
- Power & Supply Core supply range 1.425 V to 1.575 V (nominal 1.5 V) for low-power core operation.
- Package & Thermal 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) surface-mount package rated for industrial operation from −40 °C to 85 °C.
- Standards & Test Segmentable clock resources, embedded PLLs, and in-system diagnostic/debug capability for development and production testability.
Typical Applications
- High-speed data transport — Implement interface logic and protocol bridging where high internal performance and LVDS-capable I/Os enable reliable data movement.
- Communications infrastructure — Use embedded FIFOs, PLLs and deterministic timing to handle packet buffering, clocking and timing in telecom or data-center equipment.
- Industrial control — Deploy as a deterministic, nonvolatile programmable controller for motor control, sensor aggregation and machine-automation logic across an industrial temperature range.
- Security-sensitive designs — FuseLock™ programming and antifuse nonvolatile topology support designs with IP protection and reduced risk of reverse engineering.
Unique Advantages
- Nonvolatile single-chip solution: Eliminates the need for external configuration memory and simplifies system boot and security requirements.
- High-speed internal performance: 500+ MHz internal performance and on-chip PLL frequency synthesis enable demanding timing and high-throughput datapaths.
- Flexible mixed-voltage I/Os: Multi-standard I/O support and bank-selectable voltages reduce level-shifter requirements and simplify multi-domain interface designs.
- Embedded memory with FIFO control: On-chip SRAM and FIFO logic reduce external memory dependencies for buffering and streaming applications.
- Industrial temperature rating: −40 °C to 85 °C qualification supports deployments in a wide range of industrial environments.
- Design protection features: FuseLock™ and antifuse technology provide hardware-level protection against reverse engineering and IP theft.
Why Choose AX1000-1FGG484I?
The AX1000-1FGG484I delivers a balance of high logic capacity, embedded memory and flexible I/O packaged in a nonvolatile antifuse FPGA. Its AX architecture and on-chip PLLs provide deterministic timing and frequency synthesis capabilities suitable for demanding digital and mixed-signal edge applications. With industrial-grade temperature limits and hardware IP protection mechanisms, it is suited to engineers who need robust, secure and high-performance programmable logic in a single-chip solution.
Choose this device when you require scalable logic resources, embedded SRAM/FIFO, multi-standard high-speed I/Os and a nonvolatile configuration model that simplifies system design and protects your intellectual property.
Request a quote or submit an inquiry to receive pricing and availability for the AX1000-1FGG484I. Our team can provide lead-time information and help integrate this device into your design.

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