EP1S10F484C7N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,257 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 335 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1057 | Number of Logic Elements/Cells | 10570 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 920448 |
Overview of EP1S10F484C7N – Stratix® Field Programmable Gate Array, 335 I/Os, 484-FBGA
The EP1S10F484C7N is a Stratix® field programmable gate array (FPGA) from Intel, delivered in a 484-ball FBGA (23 × 23) surface-mount package. It combines programmable logic, on-chip embedded memory, and a high I/O count to support complex digital designs.
Designed for commercial-temperature applications, this device provides 10,570 logic elements, approximately 0.92 Mbits of embedded RAM, and 335 I/Os, making it suitable for high-density control, signal processing, and interface-focussed designs that require flexible, reconfigurable logic and substantial local memory.
Key Features
- Core Logic 10,570 logic elements (LEs) provide the programmable resources for implementing custom logic, state machines, and datapaths.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM for local buffering, FIFOs, and small shared memory structures.
- I/O Capability 335 I/O pins in a 484-FBGA package support dense external connectivity for parallel interfaces, buses, and multi-channel signaling.
- Stratix Architecture Features Family-level features include logic array blocks, TriMatrix memory structures, multiplier/DSP resources, and advanced I/O support such as Double-Data Rate (DDR) modes and differential I/O options, as documented in the Stratix device handbook.
- Clocking and PLLs Integrated clock networks and PLL support from the Stratix family provide flexible clocking and synchronization options for high-performance designs.
- Package & Mounting 484-FBGA (23 × 23) surface-mount package for a compact, board-level footprint suitable for high-density assemblies.
- Power and Operating Range Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Telecommunications & Networking Implement protocol offload, packet processing, and interface bridging using the device’s abundant logic and I/O resources.
- Digital Signal Processing Leverage the Stratix family’s multiplier/DSP block support and on-chip RAM for filtering, transforms, and real-time data manipulation.
- Embedded Systems & Prototyping Use the reprogrammable logic and plentiful I/Os for rapid development of control systems, custom peripherals, and prototype validation.
- High-Speed Data Acquisition Support multi-channel capture and front-end interfacing where dense I/O and local buffering reduce external component count.
Unique Advantages
- High logic density: 10,570 logic elements allow implementation of complex state machines, controllers, and moderate-scale custom processors.
- Substantial on-chip memory: Approximately 0.92 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage.
- Large I/O complement: 335 I/Os in a compact 484-FBGA package enable broad external interfacing without expanding board area significantly.
- Flexible clocking: Stratix clock networks and PLL resources provide designers with the timing flexibility needed for multi-clock systems.
- Compact surface-mount package: 484-FBGA (23 × 23) supports high-density PCB layouts while maintaining robust electrical connectivity.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation with RoHS compliance for mainstream commercial applications.
Why Choose EP1S10F484C7N?
The EP1S10F484C7N positions itself as a versatile Stratix FPGA offering a balance of logic capacity, embedded RAM, and a high I/O count in a compact surface-mount FBGA package. It is suited for designers who need a reprogrammable platform to implement complex control, interfacing, and signal-processing functions within commercial-temperature environments.
With documented Stratix family features such as advanced I/O modes, dedicated DSP/multiplier resources, and flexible clocking, the device delivers a scalable platform backed by established device handbook documentation and Intel’s FPGA ecosystem.
If you would like pricing, availability, or to submit a sourcing inquiry for EP1S10F484C7N, request a quote or submit a product inquiry to begin the procurement process.

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