EP1S10F484I6N

IC FPGA 335 I/O 484FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA

Quantity 1,461 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O335Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10F484I6N – Stratix Field Programmable Gate Array (FPGA) IC, 10,570 logic elements

The EP1S10F484I6N is an Intel Stratix series FPGA in a 484-ball FCBGA package, designed for industrial-temperature deployments. It integrates 10,570 logic elements, approximately 0.92 Mbits of on-chip memory, and 335 user I/Os to support complex digital logic, buffering and high-pin-count interfacing in compact surface-mount form factors.

Built on the Stratix device family architecture, this device targets applications requiring a balance of logic density, embedded memory and flexible I/O, while providing industrial-grade operating range and RoHS compliance for reliable board-level integration.

Key Features

  • Logic Density  10,570 logic elements provide the fabric for implementing custom digital functions and moderate to high-complexity designs.
  • Embedded Memory  Approximately 0.92 Mbits of on-chip RAM for FIFOs, buffers and on-chip data storage to support streaming and packet-based data paths.
  • High I/O Count  335 I/O pins enable wide parallel interfaces, multi-channel connectivity and extensive external device interfacing.
  • Power Supply  Core supply range specified at 1.425 V to 1.575 V to match system power rails and enable predictable power sequencing.
  • Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
  • Package & Mounting  484-ball BGA (FCBGA / 484-FBGA, 23×23) surface-mount package for high-density PCB integration.
  • Standards & Compliance  RoHS-compliant construction.
  • Stratix Family Capabilities  As part of the Stratix device family, the device benefits from the family’s architecture features such as advanced clocking/PLLs, TriMatrix memory structures and dedicated DSP/multiplier support described in the Stratix device handbook.

Typical Applications

  • Communications & Networking  High I/O count and on-chip memory make the FPGA suitable for interface bridging, protocol handling and packet buffering in networking equipment.
  • Embedded Control & Industrial Automation  Industrial temperature rating and flexible I/O support motor control, machine control logic and distributed automation functions.
  • Data Acquisition & Signal Conditioning  On-chip RAM and extensive I/O enable multi-channel data capture, preprocessing and temporary storage for downstream processing.

Unique Advantages

  • Balanced Logic and Memory:  10,570 logic elements paired with approximately 0.92 Mbits of embedded RAM allow designers to implement both control logic and local data buffering without external memory for many use cases.
  • High Pin Count for Flexible Interfaces:  335 I/Os provide the pin capacity needed for parallel buses, multiple serial lanes or mixed-signal front-ends, reducing the need for external I/O expanders.
  • Industrial Reliability:  Rated from −40 °C to 100 °C, the device aligns with industrial deployment needs where extended ambient ranges are required.
  • Compact, PCB-Friendly Package:  484-ball FCBGA (23×23) surface-mount package offers a compact footprint for space-constrained designs while maintaining high I/O density.
  • RoHS-Compliant Manufacturing:  Environmentally compliant device construction supports regulatory and sustainability requirements.
  • Family-Level Architecture:  Leverages Stratix family features—such as advanced clocking, memory modes and DSP interfaces—documented in the Stratix device handbook to accelerate system design decisions.

Why Choose EP1S10F484I6N?

The EP1S10F484I6N positions itself as a practical Stratix-class FPGA option for designers who need a well-rounded combination of logic density, embedded memory and a high number of I/Os in an industrial-temperature, surface-mount package. Its specified voltage range, package type and RoHS compliance simplify board-level integration and procurement for robust embedded systems.

This device is suited to teams building communications interfaces, industrial controllers or data-acquisition front ends that require on-chip resources and predictable operating envelopes. Choosing EP1S10F484I6N leverages the Stratix device family architecture and documentation to support design scalability and long-term maintenance.

Request a quote or submit a pricing inquiry to get availability and lead-time information for EP1S10F484I6N.

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