EP1S10F484I6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,461 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 335 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1057 | Number of Logic Elements/Cells | 10570 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 920448 |
Overview of EP1S10F484I6N – Stratix Field Programmable Gate Array (FPGA) IC, 10,570 logic elements
The EP1S10F484I6N is an Intel Stratix series FPGA in a 484-ball FCBGA package, designed for industrial-temperature deployments. It integrates 10,570 logic elements, approximately 0.92 Mbits of on-chip memory, and 335 user I/Os to support complex digital logic, buffering and high-pin-count interfacing in compact surface-mount form factors.
Built on the Stratix device family architecture, this device targets applications requiring a balance of logic density, embedded memory and flexible I/O, while providing industrial-grade operating range and RoHS compliance for reliable board-level integration.
Key Features
- Logic Density 10,570 logic elements provide the fabric for implementing custom digital functions and moderate to high-complexity designs.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM for FIFOs, buffers and on-chip data storage to support streaming and packet-based data paths.
- High I/O Count 335 I/O pins enable wide parallel interfaces, multi-channel connectivity and extensive external device interfacing.
- Power Supply Core supply range specified at 1.425 V to 1.575 V to match system power rails and enable predictable power sequencing.
- Industrial Temperature Grade Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
- Package & Mounting 484-ball BGA (FCBGA / 484-FBGA, 23×23) surface-mount package for high-density PCB integration.
- Standards & Compliance RoHS-compliant construction.
- Stratix Family Capabilities As part of the Stratix device family, the device benefits from the family’s architecture features such as advanced clocking/PLLs, TriMatrix memory structures and dedicated DSP/multiplier support described in the Stratix device handbook.
Typical Applications
- Communications & Networking High I/O count and on-chip memory make the FPGA suitable for interface bridging, protocol handling and packet buffering in networking equipment.
- Embedded Control & Industrial Automation Industrial temperature rating and flexible I/O support motor control, machine control logic and distributed automation functions.
- Data Acquisition & Signal Conditioning On-chip RAM and extensive I/O enable multi-channel data capture, preprocessing and temporary storage for downstream processing.
Unique Advantages
- Balanced Logic and Memory: 10,570 logic elements paired with approximately 0.92 Mbits of embedded RAM allow designers to implement both control logic and local data buffering without external memory for many use cases.
- High Pin Count for Flexible Interfaces: 335 I/Os provide the pin capacity needed for parallel buses, multiple serial lanes or mixed-signal front-ends, reducing the need for external I/O expanders.
- Industrial Reliability: Rated from −40 °C to 100 °C, the device aligns with industrial deployment needs where extended ambient ranges are required.
- Compact, PCB-Friendly Package: 484-ball FCBGA (23×23) surface-mount package offers a compact footprint for space-constrained designs while maintaining high I/O density.
- RoHS-Compliant Manufacturing: Environmentally compliant device construction supports regulatory and sustainability requirements.
- Family-Level Architecture: Leverages Stratix family features—such as advanced clocking, memory modes and DSP interfaces—documented in the Stratix device handbook to accelerate system design decisions.
Why Choose EP1S10F484I6N?
The EP1S10F484I6N positions itself as a practical Stratix-class FPGA option for designers who need a well-rounded combination of logic density, embedded memory and a high number of I/Os in an industrial-temperature, surface-mount package. Its specified voltage range, package type and RoHS compliance simplify board-level integration and procurement for robust embedded systems.
This device is suited to teams building communications interfaces, industrial controllers or data-acquisition front ends that require on-chip resources and predictable operating envelopes. Choosing EP1S10F484I6N leverages the Stratix device family architecture and documentation to support design scalability and long-term maintenance.
Request a quote or submit a pricing inquiry to get availability and lead-time information for EP1S10F484I6N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018