EP1S10F672C7

IC FPGA 345 I/O 672FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 345 920448 10570 672-BBGA

Quantity 1,938 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O345Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10F672C7 – Stratix® Field Programmable Gate Array, 672‑BBGA

The EP1S10F672C7 is a Stratix® family field programmable gate array (FPGA) IC from Intel, supplied in a 672‑BBGA (672‑FBGA, 27×27) surface‑mount package. It delivers a mid‑range balance of programmable logic, embedded memory, and high I/O count for complex board‑level digital designs.

Designed for applications that require programmable logic, on‑chip RAM, and flexible I/O and clocking options, this commercial‑grade device targets FPGA‑based designs where integration, configurability, and debug capability are important.

Key Features

  • Core logic capacity — 10,570 logic elements and 1,057 LABs provide a mid‑range programmable fabric for glue logic, state machines, and custom datapaths.
  • Embedded memory — Approximately 0.92 Mbits (920,448 bits) of on‑chip RAM supporting the Stratix TriMatrix memory architecture and multiple memory modes described in the device handbook.
  • I/O resources — 345 dedicated I/O pins; Stratix I/O structure includes support for double‑data‑rate interfaces and advanced I/O standards as described in the device documentation.
  • Clocking and PLLs — Stratix clocking architecture with PLL and clock network support, including enhanced and fast PLL options for flexible clock management.
  • DSP & multiplier support — Device family documentation details multiplier and DSP block interfaces for implementing arithmetic and signal‑processing functions.
  • Configuration and debug — Family features include IEEE 1149.1 (JTAG) boundary‑scan support, SignalTap II embedded logic analyzer capability, and multiple configuration modes and update options.
  • Power and supply — Core supply voltage range of 1.425 V to 1.575 V, with power consumption and operating conditions specified in the Stratix device handbook.
  • Package and mounting — 672‑BBGA / 672‑FBGA (27×27) surface‑mount package suitable for board‑level integration.
  • Operating grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards and family documentation — Comprehensive Stratix device handbook coverage for architecture, I/O timing, PLLs, memory modes, and DC/switching characteristics to guide design and validation.

Typical Applications

  • High‑density digital logic — Implement glue logic, control state machines, and custom finite‑state designs using the device's 10,570 logic elements and abundant I/O.
  • Custom signal processing — Leverage on‑chip multipliers/DSP interfaces and embedded RAM for custom filtering, data formatting, and intermediate buffering.
  • Board‑level I/O aggregation — Consolidate multiple interfaces and protocol conversions using 345 I/Os and Stratix I/O features including DDR support.
  • Prototyping and development — Use JTAG boundary‑scan and the SignalTap II embedded logic analyzer for in‑system debug and iterative design refinement.

Unique Advantages

  • Balanced logic and memory density: 10,570 logic elements paired with approximately 0.92 Mbits of embedded RAM enables a broad range of mid‑complexity designs without excessive external memory.
  • High I/O availability: 345 I/Os reduce the need for external multiplexing or interface chips when aggregating signals and peripherals.
  • Flexible clocking: Stratix PLLs and clock network options described in the device handbook provide multiple clocking modes for synchronous and high‑performance designs.
  • Integrated debug and configuration options: JTAG boundary‑scan and SignalTap II support simplify bring‑up, testing, and in‑field configuration management.
  • Board‑ready package: 672‑FBGA (27×27) surface‑mount package supports compact board designs and standardized assembly flows.
  • Commercial operating range: Rated for 0 °C to 85 °C operation, suitable for a wide variety of commercial electronics applications.

Why Choose EP1S10F672C7?

The EP1S10F672C7 offers a pragmatic combination of programmable logic, embedded memory, and extensive I/O in a single Stratix family FPGA package. Its documented architecture, clocking options, and on‑chip resources make it a suitable choice for designers building mid‑complexity FPGA solutions that require in‑system debug, flexible configuration, and a standardized board‑level package.

Backed by the Stratix device handbook and Intel's device documentation, this part is appropriate for teams seeking a commercially graded FPGA with clear hardware capabilities and well‑documented design guidance.

Request a quote or submit an inquiry for pricing and availability to evaluate EP1S10F672C7 for your next FPGA design.

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