EP1S10F780C5
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 426 920448 10570 780-BBGA |
|---|---|
| Quantity | 25 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 426 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1057 | Number of Logic Elements/Cells | 10570 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 920448 |
Overview of EP1S10F780C5 – Stratix® FPGA, 10,570 logic elements, 426 I/Os
The EP1S10F780C5 is a Stratix® Field Programmable Gate Array (FPGA) IC designed for commercial applications that require a balance of programmable logic, on-chip memory, and high I/O density. It implements the Stratix family architecture described in the device handbook, providing programmable logic array blocks, embedded memory structures, and comprehensive I/O capabilities.
With 10,570 logic elements, approximately 0.92 Mbits of embedded memory, and 426 user I/Os in a 780-ball BGA footprint, this FPGA targets system designs that need substantial logic integration, flexible memory buffering, and extensive external connectivity within a surface-mount package.
Key Features
- Stratix FPGA architecture Logic array blocks and Stratix device family features as documented in the Stratix Device Handbook provide the device architecture and functional building blocks.
- Logic resources 10,570 logic elements (LEs) for implementing custom digital logic and control functions.
- Embedded memory Approximately 0.92 Mbits (920,448 bits) of on-chip RAM for buffering, frame storage, and intermediate data structures.
- High I/O count 426 user I/O pins to support wide external interfaces and multi-channel connectivity.
- Package and mounting 780-ball BGA package (780-BBGA) / supplier package 780-FBGA (29×29) in a surface-mount form factor for compact board-level integration.
- Supply voltage Core supply range 1.425 V to 1.575 V to match common FPGA power rail designs.
- Commercial temperature grade Rated for 0 °C to 85 °C operating temperature for commercial environment deployments.
- Configuration & testing support Device documentation includes support for IEEE 1149.1 (JTAG) boundary-scan and embedded debug/configuration features referenced in the Stratix handbook.
- RoHS compliant Conforms to RoHS requirements for lead-free assembly and regulatory compliance.
Typical Applications
- Communications & Networking — High I/O density and on-chip memory make the device suitable for interface bridging, packet buffering, and protocol handling in commercial networking equipment.
- Digital Signal Processing — The combination of logic elements and embedded RAM supports custom DSP pipelines, filtering, and data-path acceleration in signal-processing systems.
- System Prototyping & Development — Programmable logic resources and comprehensive configuration/testing support facilitate rapid hardware prototyping and iterative development.
- High-density I/O Control — Large number of user I/Os enables multi-channel sensor interfacing, I/O aggregation, and complex peripheral control in commercial products.
Unique Advantages
- Highly configurable logic capacity: 10,570 logic elements allow designers to implement complex custom logic and control functions without immediate need for external ASICs.
- Substantial on-chip memory: Approximately 0.92 Mbits of embedded RAM supports buffering, packet storage, and state machines within the FPGA fabric.
- Extensive external connectivity: 426 user I/Os provide flexibility to connect wide buses, multiple interfaces, or parallel channels directly to the FPGA.
- Compact surface-mount package: 780-ball BGA (780-FBGA, 29×29) enables high-density PCB layouts while maintaining robust connection count for complex systems.
- Commercial-grade operating range: Rated 0 °C to 85 °C and RoHS compliant for deployment in commercial electronic products.
- Documented Stratix feature set: Device handbook coverage of logic array blocks, memory modes, PLLs/clock networks, I/O structure, and configuration/testing provides technical guidance for integration.
Why Choose EP1S10F780C5?
The EP1S10F780C5 positions itself as a capable Stratix family FPGA for commercial designs that require a balanced combination of programmable logic, embedded memory, and high I/O capacity. Its documented Stratix architecture and device handbook coverage help engineers design reliable clocking, memory, and I/O schemes while leveraging 10,570 logic elements and roughly 0.92 Mbits of on-chip RAM.
This part is well suited to customers developing communication interfaces, DSP accelerators, or multi-channel control systems who need a compact surface-mount FPGA in a 780-ball BGA footprint with a defined commercial operating range and RoHS compliance.
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