EP1S10F780C5N

The EP1S10F780C5N is a Stratix® family Field Programmable Gate Array (FPGA) from Intel, offered in a 780-ball fine-pitch BGA package. It provides a balanced combination of programmable logic, embedded memory, and extensive I/O suitable for medium-density custom logic and board-level integration.

Built on the Stratix device architecture, this device targets applications that require sizable on-chip logic (10,570 logic elements), approximately 0.92 Mbits of embedded RAM, and up to 426 I/O pins while operating within a commercial temperature and a 1.425–1.575 V core supply range.

Key Features

• Core Logic — 10,570 logic elements and 1,057 logic array blocks (LABs) provide substantial programmable logic resources for mid-density designs.
• Embedded Memory — Approximately 0.92 Mbits of on-chip RAM to implement buffers, FIFOs, and small data stores without external memory.
• I/O Density — Up to 426 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Package — 780-ball FBGA (29 × 29 ball array) surface-mount package for compact PCB integration and high pin count routing.
• Power — Core supply range 1.425 V to 1.575 V, enabling controlled power budgeting for system designs.
• Operating Range — Commercial grade device specified for 0 °C to 85 °C operation.
• Configuration & Test Support — Stratix family documentation details configuration options, JTAG boundary-scan, and embedded logic analysis capabilities relevant to this device family.
• Architecture & Clocking — Stratix architecture provides structured logic array blocks, memory modes, PLLs and clock networks as described in the device handbook for timing and clock management.
• Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Data-path and DSP control — Use the device’s logic fabric and embedded memory to implement custom data processing pipelines and control logic.
• High-density I/O bridging — Leverage 426 I/O pins for parallel bus interfacing, protocol conversion, or board-level I/O aggregation.
• Memory interface logic — Implement external RAM interfacing and controller glue logic using on-chip memory and the Stratix I/O structure.
• Programmable prototyping — Deploy as a development platform for mid-scale custom logic, leveraging the documented Stratix configuration and debug features.

Unique Advantages

• Substantial programmable logic: 10,570 logic elements and 1,057 LABs give designers the headroom to implement complex custom logic without immediate migration to larger families.
• Significant embedded memory: Approximately 0.92 Mbits of on-chip RAM reduces reliance on external memory for many buffering and temporary storage needs.
• High I/O count: 426 I/O pins support multi-channel interfaces and rich board-level connectivity, simplifying system integration.
• Commercial-ready package and temperature rating: 780-FBGA (29 × 29) surface-mount package and 0 °C to 85 °C operating range suit a wide set of commercial products and assemblies.
• Vendor documentation and architecture: Stratix device handbook content documents logic architecture, PLLs, memory modes, and configuration features to support design and verification.
• Regulatory alignment: RoHS compliance supports lead-free manufacturing requirements.

Why Choose EP1S10F780C5N?

EP1S10F780C5N positions itself as a mid-density Stratix FPGA option combining over ten thousand logic elements, nearly one megabit of embedded RAM, and high I/O capacity in a compact 780-ball FBGA package. It is suitable for design teams needing configurable logic, on-chip memory, and abundant I/O within a commercial temperature range and defined core-voltage window.

Documented Stratix architecture and configuration features help accelerate development, while RoHS compliance and the surface-mount 780-FBGA package support modern manufacturing flows and board-level integration.

Request a quote or submit a sales inquiry to begin evaluation and procurement of EP1S10F780C5N for your next design.