EP1S10F780C6

The EP1S10F780C6 is a Stratix® Field Programmable Gate Array (FPGA) in a 780-BBGA surface-mount package designed for high-density logic and I/O integration. The device provides 10,570 logic elements and approximately 0.92 Mbits of embedded RAM, alongside 426 I/O pins, making it suitable for designs that require substantial on-chip logic, memory, and external connectivity.

Key electrical and environmental parameters include a core supply range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is supplied in a 780-FBGA (29 × 29) package footprint.

Key Features

• Core Logic 10,570 logic elements for implementing complex digital logic and custom compute fabrics.
• Logic Array Blocks 1,057 logic array blocks (LABs/CLBs) as documented for the Stratix family to structure and scale logic resources.
• Embedded Memory Approximately 0.92 Mbits of on-chip RAM organized for flexible memory modes and block configurations.
• I/O Resources 426 I/O pins with support for Stratix I/O features such as double-data-rate signaling, high-speed differential I/O, programmable drive strength, and on-chip termination (per the Stratix device family documentation).
• Clocking & DSP Support Dedicated PLLs and clock networks plus DSP/multiplier resources are part of the Stratix architecture to support synchronized clocking and arithmetic functions.
• Configuration & Debug Family features include JTAG boundary-scan support, SignalTap II embedded logic analysis, and multiple configuration schemes, enabling in-system test and instrumented debug flows.
• Package & Mounting 780-BBGA (supplier package: 780-FBGA, 29 × 29) in a surface-mount form factor for board-level integration.
• Supply & Temperature Core voltage supply 1.425 V–1.575 V and commercial grade operating temperature of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Implement custom logic blocks and DSP pipelines using the device's logic elements and on-chip multipliers.
• I/O-intensive interfaces — Support complex board-level connectivity and multi-protocol front-ends with 426 I/O pins and Stratix I/O features.
• Embedded memory architectures — Use approximately 0.92 Mbits of embedded RAM for buffering, packet memory, and state storage within system designs.
• Configurable control and prototyping — Leverage JTAG, SignalTap II, and flexible configuration schemes for in-system debugging and iterative development.

Unique Advantages

• High logic density: 10,570 logic elements provide the capacity to implement sizable custom logic and interfaces on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 0.92 Mbits of embedded RAM supports local buffering and memory-intensive functions without external memory.
• Large I/O footprint: 426 I/O pins enable extensive external connectivity for multi-channel systems and high-pin-count interfaces.
• Robust clocking and DSP support: Stratix family clock networks and DSP resources enable synchronized multi-clock designs and arithmetic acceleration where needed.
• Flexible integration: Surface-mount 780-BBGA package (780-FBGA, 29 × 29) balances high pin count with board-level density for compact system layouts.
• Development & testability: On-device configuration and embedded logic analysis features simplify development, bring-up, and in-field diagnostics.

Why Choose EP1S10F780C6?

The EP1S10F780C6 positions itself as a capable Stratix FPGA option where a balance of logic capacity, embedded memory, and extensive I/O is required in a surface-mount BGA package. Its documented Stratix architecture elements—logic array blocks, memory modes, clocking resources, and I/O features—support system designs that demand configurable compute fabric with sizable on-chip resources.

This device is aimed at teams designing commercial-temperature systems that require scalable logic density, integrated memory, and comprehensive I/O while benefiting from Stratix family configuration and debug capabilities. Its package and electrical parameters make it suitable for compact, board-level integration with established development flows.

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