EP1S10F780C7

IC FPGA 426 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 426 920448 10570 780-BBGA

Quantity 336 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O426Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10F780C7 – Stratix Field Programmable Gate Array, 10,570 logic elements, 780-BBGA

The EP1S10F780C7 is a Stratix® Field Programmable Gate Array (FPGA) from Intel presented in a 780‑ball BGA package. This commercial‑grade, surface‑mount FPGA provides 10,570 logic elements and approximately 0.92 Mbits of on‑chip RAM, with a 426‑pin I/O capability for high‑pin‑count system designs.

Designed around the Stratix family architecture described in the device handbook, the device combines configurable logic, embedded memory, and advanced I/O and clocking capabilities to support system integration tasks where a high I/O count, on‑chip memory, and a compact BGA package are required. Electrical operation is supported across a core supply window of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic 10,570 logic elements to implement combinational and sequential logic functions for complex digital designs.
  • Embedded Memory Approximately 0.92 Mbits of on‑chip RAM for buffering, FIFOs, and small data-store functions without external memory.
  • I/O Density 426 I/O pins enable dense peripheral and board‑level connectivity for multi‑lane interfaces and parallel buses.
  • Power and Voltage Core supply specified from 1.425 V to 1.575 V to match system power rails and sequencing requirements.
  • Package and Mounting 780‑BBGA package (supplier device package: 780‑FBGA, 29×29) in a surface‑mount form factor for compact PCB integration.
  • Operating Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard industrial and commercial applications.
  • Stratix Family Capabilities (per device handbook) Architecture documentation for the Stratix family covers logic array blocks, memory modes, multiplier/DSP block interfaces, PLLs and clock networks, and advanced I/O, providing a platform of established FPGA features for system designers.
  • Environmental Compliance RoHS‑compliant construction for alignment with common environmental requirements.

Typical Applications

  • High‑Density Logic Prototyping Use the device’s 10,570 logic elements and substantial I/O count to implement board‑level prototypes and validate complex logic before production.
  • Data and Signal Processing Embedded RAM and the Stratix family’s documented multiplier/DSP interfaces support buffering and localized processing tasks.
  • Interface and Protocol Bridging A large number of I/O pins makes the device suitable for designs that require multiple parallel interfaces or protocol translation between subsystems.
  • Embedded System Integration On‑chip memory and configurable logic let designers consolidate glue logic and small data‑path functions into a single packaged FPGA.

Unique Advantages

  • Substantial Logic Capacity: 10,570 logic elements enable implementation of complex control and data‑path functions without immediate need for additional programmable devices.
  • High I/O Count: 426 I/O pins reduce external interface multiplexing and simplify routing for multi‑lane or multi‑bus designs.
  • Integrated On‑Chip Memory: Approximately 0.92 Mbits of embedded RAM provides local storage for FIFOs, buffers, and small data structures, lowering dependence on external memory for some use cases.
  • Compact BGA Packaging: 780‑ball BGA (29×29 supplier package) offers a space‑efficient footprint for high‑density boards and surface‑mount assembly.
  • Documented Stratix Architecture: Family handbook chapters covering clocking, memory modes, and I/O structure provide design guidance and architectural features to leverage in system designs.
  • Regulatory Readiness: RoHS compliance simplifies environmental qualification and procurement in many regions.

Why Choose EP1S10F780C7?

The EP1S10F780C7 positions itself as a Stratix‑family FPGA option for designers who need a balance of logic density, embedded memory, and a high I/O count in a compact BGA package. Its documented Stratix architecture and on‑chip resources make it suitable for consolidating control, interfacing, and moderate‑complexity processing tasks into a single device.

This part is appropriate for commercial applications requiring a surface‑mount FPGA with a 1.425 V–1.575 V core supply and a 0 °C–85 °C operating range. The combination of logic elements, embedded RAM, and extensive I/O supports scalable designs and reduces external component count for many system integration scenarios.

Request a quote or submit an inquiry for pricing and availability of EP1S10F780C7 to evaluate this Stratix FPGA for your next design.

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