EP1S20B672C6

IC FPGA 426 I/O 672BGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA

Quantity 353 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O426Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20B672C6 – Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA

The EP1S20B672C6 is a Stratix® family field programmable gate array (FPGA) from Intel (Altera) packaged in a 672-ball BGA (35 × 35 mm). It provides a mid‑range programmable logic platform combining approximately 18,460 logic elements, roughly 1.67 Mbits of embedded memory, and a high I/O count for complex digital designs.

This device is suited to commercial‑grade applications that require dense logic integration, substantial on‑chip RAM, and flexible I/O. Key value propositions include a high logic element count, substantial embedded memory capacity, and a 426-pin I/O footprint in a compact surface‑mount BGA package.

Key Features

  • Programmable Logic Capacity – Approximately 18,460 logic elements provide a substantial resource pool for implementing custom logic, state machines, and datapaths.
  • Embedded Memory – Approximately 1.67 Mbits of on‑chip RAM supports buffers, FIFOs, and local storage for high‑performance logic functions.
  • I/O Density – 426 user I/O pins enable extensive external interfacing and support complex multi‑lane or multi‑peripheral designs.
  • Package & Mounting – 672‑BBGA (672‑BGA, 35 × 35 mm) surface‑mount package offers a high‑pin‑count, compact footprint for board integration.
  • Power Supply Range – Core voltage supply specified at 1.425 V to 1.575 V for deterministic power planning and board design.
  • Commercial Temperature Range – Rated for 0 °C to 85 °C operation, suitable for commercial‑grade systems and environments.
  • Architecture & Tooling (Series-Level) – The Stratix device handbook describes architecture elements such as logic array blocks, TriMatrix memory, PLLs and clock networks, configurable I/O structures, and configuration/testing support (JTAG, SignalTap II), which are part of the Stratix family design philosophy.
  • Regulatory Compliance – RoHS compliant.

Typical Applications

  • High‑density custom logic – Implement state machines, protocol engines, and application‑specific accelerators that benefit from a large pool of logic elements and embedded memory.
  • I/O‑intensive systems – Use the 426 I/O pins for multi‑lane interfaces, parallel buses, or dense sensor and peripheral interconnects.
  • Embedded buffering and data staging – Leverage approximately 1.67 Mbits of on‑chip RAM for FIFOs, packet buffers, and temporary data storage in throughput‑sensitive designs.

Unique Advantages

  • High logic density: The device’s ~18,460 logic elements allow significant functionality to be integrated on a single FPGA, reducing external ASIC/FPGA counts.
  • Substantial on‑chip memory: Approximately 1.67 Mbits of embedded RAM supports local data processing without relying solely on external memory, simplifying board design.
  • Extensive I/O resources: 426 user I/O pins enable flexible system partitioning and direct interfacing to multiple peripherals or high‑pin‑count connectors.
  • Compact high‑pin package: The 672‑BBGA (35 × 35 mm) provides a high I/O and logic density in a controlled, surface‑mount footprint suited to compact commercial designs.
  • Commercial operating range: Specified 0 °C to 85 °C operation aligns with many commercial applications and environments.
  • RoHS compliant: Meets common lead‑free assembly and environmental sourcing requirements.

Why Choose EP1S20B672C6?

The EP1S20B672C6 positions itself as a robust, commercial‑grade Stratix FPGA offering a balance of logic capacity, embedded memory, and I/O density in a compact 672‑BBGA package. It is well suited for designs that require significant programmable logic alongside substantial on‑chip RAM and broad interfacing capability.

Engineers and procurement teams seeking a scalable, well‑documented FPGA platform for mid‑to‑high complexity commercial applications will find this device aligns with needs for integration density, predictable power rails (1.425–1.575 V), and a defined operating temperature range. The Stratix family handbook provides detailed architectural and configuration guidance for system integration and timing planning.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for EP1S20B672C6. Our team can assist with part availability and sourcing for your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up