EP1S20B672C7

The EP1S20B672C7 is a Stratix® Field Programmable Gate Array (FPGA) in a 672-ball BGA surface-mount package. It integrates 18,460 logic elements, approximately 1.67 Mbits of embedded RAM, and 426 I/O pins to support complex, board-level programmable logic implementations.

Targeted for commercial designs that require dense logic resources, substantial on-chip memory, and a high I/O count, this device operates from a core supply range of 1.425 V to 1.575 V and is specified for 0 °C to 85 °C operation.

Key Features

• Core logic density — 18,460 logic elements enabling complex user-defined logic implementations and system integration on a single device.
• Embedded memory — Approximately 1.67 Mbits of on-chip RAM for buffering, packet storage, and intermediate data structures.
• High I/O count — 426 programmable I/O pins to support wide external interfaces and parallel connectivity.
• Power and voltage — Core supply specified between 1.425 V and 1.575 V to match board-level power sequencing and regulator designs.
• Package and mounting — 672-BBGA (672-BGA, 35×35 mm) surface-mount package for compact, high-density PCB layouts.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for general-purpose commercial applications.
• Configuration and test support — Device family documentation includes configuration, JTAG boundary-scan support, and embedded logic analysis capabilities described in the Stratix device handbook.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Communications and networking — Use the device’s dense logic, on-chip RAM, and high I/O count for protocol handling, packet buffering, and interface bridging.
• High-speed I/O and memory interfacing — Suitable for designs that require DDR or wide parallel interfaces and external RAM interfacing as covered by the device family documentation.
• DSP and signal processing — On-chip memory and the Stratix architecture features (including multiplier/DSP resources described in the handbook) support embedded signal-processing pipelines.
• Instrumentation and test systems — JTAG boundary-scan and embedded logic analyzer features in the device family aid development, debug, and production test flows.

Unique Advantages

• High integration density: 18,460 logic elements and ~1.67 Mbits of embedded RAM reduce external component count and simplify system design.
• Large I/O capacity: 426 I/O pins provide the versatility to interface with multiple buses, peripherals, and memory devices without additional multiplexing logic.
• Compact BGA packaging: 672-ball BGA (35×35 mm) enables a high pin-count solution in a compact footprint for space-constrained PCBs.
• Design-for-test and debug: Device family features include JTAG boundary-scan and embedded logic analysis to accelerate bring-up and troubleshooting.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation to match a wide range of commercial applications and environments.
• Regulatory and environmental compliance: RoHS compliance supports environmentally conscious designs and manufacturing processes.

Why Choose EP1S20B672C7?

The EP1S20B672C7 delivers a balanced combination of logic capacity, embedded memory, and a high pin count in a 672-ball BGA package, making it appropriate for commercial designs that consolidate multiple functions into a single FPGA. Its documented device-family features for configuration, PLLs, memory modes, and test support provide the technical foundation needed for system-level integration.

This part is well suited to engineering teams building communications interfaces, DSP subsystems, or instrumentation platforms where on-chip resources and extensive I/O simplify board-level design. Its commercial temperature rating, controlled core voltage range, and RoHS compliance provide predictable behavior and supply-chain compatibility for production designs.

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