EP1S20B672C6N

The EP1S20B672C6N is a Stratix-series Field Programmable Gate Array from Intel designed for commercial-grade programmable logic applications. It integrates a substantial array of logic elements, embedded memory, and a large I/O complement in a 672-ball BGA package to support complex, board-level digital designs.

The device implements the Stratix architecture and includes architecture-level capabilities documented in the Stratix device handbook, providing PLLs and clock networks, DSP interfaces, advanced I/O structure, and configuration and debug features suitable for commercial embedded systems and high-density digital designs.

Key Features

• Core Logic  Approximately 18,460 logic elements organized across 1,846 LABs to implement custom digital logic and control functions.
• Embedded Memory  Approximately 1.67 Mbits of on-chip RAM (1,669,248 bits) for buffering, FIFOs, and on-chip data storage.
• High I/O Count  426 user I/O pins to interface with high-pin-count peripherals and multi-lane external devices.
• Package & Mounting  672-BBGA package (supplier device package: 672-BGA (35x35)) in a surface-mount form factor for compact, high-density PCB layouts.
• Power  Core supply range specified at 1.425 V to 1.575 V for predictable power sequencing and integration into regulated power rails.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature, suitable for commercial applications.
• Stratix Architecture Features  Architecture-level capabilities referenced in the device handbook including PLLs & clock networks, DSP block interface, TriMatrix memory modes, multi-track interconnect, and multiplier/adder resources.
• Configuration & Test  Supports JTAG boundary-scan and embedded debug features such as the SignalTap II logic analyzer and partial reconfiguration modes described in the Stratix device handbook.
• Standards & Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implement complex control, signal processing, or protocol logic where a balance of logic capacity and on-chip memory is required.
• High-Density I/O Interfaces  Serve as an interface hub or protocol bridge where many external signals must be aggregated or translated.
• Prototyping & System Integration  Use the device for board-level prototyping and integration of custom digital subsystems leveraging on-chip debug and configuration features.

Unique Advantages

• High Logic Capacity:  Approximately 18,460 logic elements enable implementation of sizable custom logic blocks without immediate need for external FPGA resources.
• Substantial On-Chip Memory:  Around 1.67 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Large I/O Complement:  426 I/O pins provide flexibility for multi-channel interfaces and complex board-level routing.
• Stratix Architecture Capabilities:  Built-in architecture features such as PLLs, DSP interfaces, and advanced I/O support aid system designers in meeting timing and interface requirements described in the Stratix device handbook.
• Commercial Readiness:  0 °C to 85 °C operating range and RoHS compliance make the device suitable for a wide range of commercial deployments.
• Compact, High-Density Package:  The 672-BBGA (672-BGA (35x35)) package offers a compact footprint for dense PCB designs using surface-mount assembly.

Why Choose EP1S20B672C6N?

The EP1S20B672C6N combines a substantial complement of logic elements, on-chip memory, and a high pin-count I/O package within the Stratix architecture, making it a practical choice for commercial designs that require integrated programmable logic and system-level flexibility. Its documented architecture-level features and configuration/debug capabilities support complex timing, clocking, and partial reconfiguration workflows.

This device is well suited to engineers and teams developing commercial embedded systems, interface hubs, or prototype platforms that need predictable electrical characteristics (1.425–1.575 V core) and a compact BGA package for high-density board layouts. The Stratix documentation provides detailed guidance for integration, timing, and configuration to support development and long-term deployment.

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