EP1S10F780I6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 426 920448 10570 780-BBGA |
|---|---|
| Quantity | 525 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 426 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1057 | Number of Logic Elements/Cells | 10570 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 920448 |
Overview of EP1S10F780I6N – Stratix Field Programmable Gate Array, 780‑BBGA
The EP1S10F780I6N is a Stratix® FPGA IC from Intel, delivered in a 780‑ball BGA (29×29) package. It provides a programmable fabric with 10,570 logic elements, approximately 0.92 Mbits of embedded RAM, and a high I/O count of 426 pins, making it suitable for designs that require substantial logic density and rich I/O connectivity.
Built on the Stratix family architecture, the device includes the family-level capabilities documented in the Stratix Device Handbook such as logic array blocks, TriMatrix memory structures, DSP block interfaces, and comprehensive PLL and clock network support, enabling complex timing and signal-management topologies.
Key Features
- Core Logic 10,570 logic elements provide programmable combinational and sequential resources for implementing custom digital logic and control functions.
- Embedded Memory Approximately 0.92 Mbits of on‑chip RAM to support buffering, FIFOs, and small embedded data stores.
- I/O Capacity 426 I/O pins for broad interfacing options and high channel counts.
- Stratix Architecture Documented Stratix features such as logic array blocks, TriMatrix memory modes, DSP block interface, and advanced clocking (PLLs and global/hierarchical clock networks) are part of the device family.
- Package & Mounting 780‑BBGA (supplier package listed as 780‑FBGA, 29×29) with surface‑mount construction for compact board-level integration.
- Power Target supply voltage range is 1.425 V to 1.575 V, enabling predictable power design around the core rails.
- Operating Temperature Industrial grade thermal rating from 0 °C to 85 °C for deployment in commercial and industrial environments.
- Regulatory RoHS‑compliant manufacturing.
Typical Applications
- High‑density digital systems Use the 10,570 logic elements to implement complex custom logic, state machines, and control blocks where substantial programmable gate count is required.
- Interface bridging and I/O aggregation High I/O count (426 pins) supports multi‑channel interfaces, protocol bridging, and aggregator functions between subsystems.
- On‑chip buffering and data handling Approximately 0.92 Mbits of embedded memory is suitable for FIFO buffering, small packet storage, and intermediate data staging.
Unique Advantages
- High logic capacity: 10,570 logic elements allow substantial logic implementation on a single device, reducing the need for multiple FPGAs in many designs.
- Significant on‑chip memory: Approximately 0.92 Mbits of embedded RAM provides dedicated on‑die memory for buffering and local data processing.
- Extensive I/O availability: 426 I/O pins enable dense external connectivity and support for multiple parallel interfaces without external multiplexing.
- Stratix family capabilities: Family‑level features such as TriMatrix memory modes, DSP block interface, and PLL/clock network support simplify implementation of advanced timing and data path functions.
- Industrial temperature range: Rated from 0 °C to 85 °C to meet the environmental needs of commercial and industrial applications.
- Compact BGA packaging: 780‑BBGA (29×29) provides a space‑efficient footprint for board designs requiring high integration.
Why Choose EP1S10F780I6N?
The EP1S10F780I6N positions itself as a high‑capacity Stratix FPGA option offering a balanced mix of logic resources, embedded memory, and substantial I/O in a compact BGA package. Its documented Stratix family features—including memory modes, DSP interfaces, and advanced clocking—help engineers implement complex timing and data‑path designs while keeping system integration streamlined.
This device is well suited for design teams needing significant on‑chip logic and memory alongside dense connectivity, and for projects that benefit from the extensive technical documentation available for the Stratix family. The industrial temperature rating and RoHS compliance add predictable deployment characteristics for commercial and industrial applications.
Request a quote or submit an inquiry to receive pricing and availability for the EP1S10F780I6N and to discuss how it fits your next FPGA design.

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