EP1S10F484C7

IC FPGA 335 I/O 484FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA

Quantity 600 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O335Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10F484C7 – Stratix® FPGA, 335 I/O, ~0.92 Mbit RAM, 10,570 logic elements, 484-FBGA

The EP1S10F484C7 is a Stratix® field-programmable gate array (FPGA) supplied in a 484-ball FCBGA package. It provides 10,570 logic elements, approximately 0.92 Mbits of on-chip RAM, and 335 I/O pins for complex, board-level digital designs.

Designed for commercial applications, this device combines the Stratix family architecture—including programmable clock networks, memory structures, and I/O capabilities—with a compact 484-FBGA (23×23) surface-mount package and a nominal core supply range of 1.425 V to 1.575 V.

Key Features

  • Logic Capacity 10,570 logic elements (LEs) to implement custom digital logic, control functions, and glue logic on a single device.
  • Embedded Memory Approximately 0.92 Mbits of on-chip RAM organized for versatile memory modes and fast local storage.
  • I/O Density & Standards 335 I/O pins in a 484-FBGA package enabling dense board-level connectivity and support for advanced I/O structures referenced in the Stratix device family.
  • Clocking & DSP Support Stratix architecture documentation highlights comprehensive clock networks and PLL support plus dedicated DSP/MAC resources suitable for signal-processing tasks.
  • Configuration & Test Family-level features include IEEE 1149.1 (JTAG) boundary-scan support and an embedded logic analyzer (SignalTap II) capability for in-system debug and verification.
  • Memory & Interconnect Architecture TriMatrix memory architecture and flexible memory modes described for the Stratix family enable varied single-port and dual-port memory configurations and efficient data paths.
  • Package & Mounting 484-BBGA/FCBGA surface-mount package (supplier device package: 484-FBGA, 23×23) for compact board design and high I/O density.
  • Power & Environmental Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Communications Equipment Use the device’s high I/O count and Stratix family high-speed I/O support for protocol interfacing, framing, and timing-critical functions in network and telecom gear.
  • High-Performance Signal Processing Combine logic capacity, embedded RAM, and family DSP block support to implement filters, transforms, and pipeline processing for audio, video, and RF applications.
  • Board-Level Prototyping & Evaluation Leverage abundant logic elements and on-chip memory for rapid proof-of-concept, hardware/software partitioning, and system integration testing.
  • Embedded Control & Glue Logic Implement custom controllers, bus bridging, and peripheral interfaces where a mix of logic density and flexible I/O is required.

Unique Advantages

  • High Logic Density: 10,570 logic elements provide substantial gateware capacity for complex functions without adding external ASICs or CPLDs.
  • Substantial On-chip Memory: Approximately 0.92 Mbits of embedded RAM reduces the need for external memory for many buffering and local storage tasks.
  • Flexible I/O Count: 335 I/O pins in a compact FCBGA package enable dense connectivity for multi-channel designs and high pin-count interfaces.
  • Stratix Family Architecture: Documented features such as programmable PLLs, TriMatrix memory organization, and DSP block interfaces offer architectural options for timing, memory, and numeric processing.
  • Designed for Board Integration: Surface-mount 484-FBGA (23×23) package simplifies high-density PCB layouts while meeting commercial temperature and RoHS requirements.

Why Choose EP1S10F484C7?

The EP1S10F484C7 positions itself as a compact, capable Stratix FPGA option for commercial designs that demand a balance of logic capacity, embedded memory, and high I/O density in a 484-FBGA package. Its documented family features—programmable clock networks, memory modes, and debug/configuration options—support complex, timing-sensitive applications and system integration tasks.

This device is well suited to designers building communications, signal-processing, and embedded control systems who need a programmable, board-integrated solution with a clear supply-voltage envelope (1.425 V–1.575 V), commercial operating range (0 °C–85 °C), and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the EP1S10F484C7 and to discuss how it fits your next FPGA-based design.

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