EP1S10F484C5

IC FPGA 335 I/O 484FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA

Quantity 204 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O335Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10F484C5 – Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA

The EP1S10F484C5 is a Stratix family FPGA from Intel (Altera) that integrates 10,570 logic elements, approximately 0.92 Mbits of on-chip RAM, and 335 general-purpose I/O pins in a 484-ball FCBGA package. The device is specified for commercial operation with a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Built on the Stratix architecture, the device provides the on-chip resources and configurability needed for logic-dense, memory-aware, and I/O-intensive applications where compact packaging and surface-mount assembly are required.

Key Features

  • Core Logic 10,570 logic elements organized across 1,057 LABs provide a substantial programmable fabric for combinational and sequential logic.
  • Embedded Memory Approximately 0.92 Mbits of on-chip RAM (920,448 total bits) supports data buffering, LUT storage, and small on-chip caches.
  • I/O Resources 335 I/O pins enable wide external connectivity and parallel interfacing to peripherals and memory devices.
  • Clocking and DSP Capabilities (Stratix Architecture) Stratix device architecture includes dedicated clock networks, PLLs, and DSP-oriented resources described in the device handbook to support synchronized logic and signal-processing building blocks.
  • Configuration & Test Support Device-level features in the Stratix family include JTAG boundary-scan, SignalTap II embedded logic analyzer, and configuration options referenced in the Stratix Device Handbook.
  • Power and Temperature Specified supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C for standard application environments.
  • Package and Mounting 484-ball BGA (484-FBGA, 23×23) surface-mount package delivers a compact, high-density solution for PCB integration.
  • Compliance RoHS-compliant to support modern manufacturing and environmental requirements.

Typical Applications

  • High-density logic integration — Implement complex state machines, protocol bridges, and glue logic using the device's 10,570 logic elements and abundant on-chip routing.
  • Signal processing and DSP blocks — Leverage the Stratix architecture's DSP-oriented features and on-chip memory for filtering, accumulation, and other fixed-point processing tasks.
  • Memory interface and buffering — Use approximately 0.92 Mbits of embedded RAM for data buffering, FIFO implementation, and small on-chip caches to support external memory transactions.
  • High-pin-count I/O subsystems — 335 I/O pins provide parallel interfaces for peripherals, transceivers, and board-level interconnects in communications and instrumentation designs.

Unique Advantages

  • Substantial programmable fabric: 10,570 logic elements enable implementation of multi-function logic and moderate-complexity designs without external ASICs.
  • On-chip memory capacity: Approximately 0.92 Mbits of embedded RAM reduces dependence on external memory for buffering and short-term storage.
  • High I/O count: 335 I/O pins support wide parallel buses and multiple peripheral connections, simplifying board-level design.
  • Stratix architecture features: Integrated clock networks, PLLs, and DSP-oriented resources provide design flexibility for timing and signal-processing tasks as described in the Stratix Device Handbook.
  • Compact BGA package: 484-ball FCBGA (23×23) surface-mount package balances high pin count with space-efficient PCB integration.
  • Manufacturing-friendly: RoHS compliance and standard commercial grade specification align with modern production and component sourcing practices.

Why Choose EP1S10F484C5?

The EP1S10F484C5 positions itself as a compact, FPGA-based solution for designs that require a balance of logic density, embedded memory, and a high number of I/O pins within a surface-mount BGA package. Its inclusion in the Stratix family means designers can reference established architecture and configuration features such as dedicated clocking resources and on-chip DSP/memory blocks documented in the Stratix Device Handbook.

This device is well suited to OEMs and engineering teams developing communications interfaces, signal-processing modules, or board-level controllers where commercial-grade temperature ratings and RoHS compliance are required. Choosing EP1S10F484C5 provides a scalable building block within the Stratix ecosystem for mid-range FPGA applications.

If you would like pricing, availability, or to request a formal quote for EP1S10F484C5, submit an inquiry or quote request to our sales team and include your desired quantities and application details.

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