EP1S10F484C5
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA |
|---|---|
| Quantity | 204 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 335 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1057 | Number of Logic Elements/Cells | 10570 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 920448 |
Overview of EP1S10F484C5 – Stratix® Field Programmable Gate Array (FPGA) IC 335 920448 10570 484-BBGA, FCBGA
The EP1S10F484C5 is a Stratix family FPGA from Intel (Altera) that integrates 10,570 logic elements, approximately 0.92 Mbits of on-chip RAM, and 335 general-purpose I/O pins in a 484-ball FCBGA package. The device is specified for commercial operation with a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.
Built on the Stratix architecture, the device provides the on-chip resources and configurability needed for logic-dense, memory-aware, and I/O-intensive applications where compact packaging and surface-mount assembly are required.
Key Features
- Core Logic 10,570 logic elements organized across 1,057 LABs provide a substantial programmable fabric for combinational and sequential logic.
- Embedded Memory Approximately 0.92 Mbits of on-chip RAM (920,448 total bits) supports data buffering, LUT storage, and small on-chip caches.
- I/O Resources 335 I/O pins enable wide external connectivity and parallel interfacing to peripherals and memory devices.
- Clocking and DSP Capabilities (Stratix Architecture) Stratix device architecture includes dedicated clock networks, PLLs, and DSP-oriented resources described in the device handbook to support synchronized logic and signal-processing building blocks.
- Configuration & Test Support Device-level features in the Stratix family include JTAG boundary-scan, SignalTap II embedded logic analyzer, and configuration options referenced in the Stratix Device Handbook.
- Power and Temperature Specified supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C for standard application environments.
- Package and Mounting 484-ball BGA (484-FBGA, 23×23) surface-mount package delivers a compact, high-density solution for PCB integration.
- Compliance RoHS-compliant to support modern manufacturing and environmental requirements.
Typical Applications
- High-density logic integration — Implement complex state machines, protocol bridges, and glue logic using the device's 10,570 logic elements and abundant on-chip routing.
- Signal processing and DSP blocks — Leverage the Stratix architecture's DSP-oriented features and on-chip memory for filtering, accumulation, and other fixed-point processing tasks.
- Memory interface and buffering — Use approximately 0.92 Mbits of embedded RAM for data buffering, FIFO implementation, and small on-chip caches to support external memory transactions.
- High-pin-count I/O subsystems — 335 I/O pins provide parallel interfaces for peripherals, transceivers, and board-level interconnects in communications and instrumentation designs.
Unique Advantages
- Substantial programmable fabric: 10,570 logic elements enable implementation of multi-function logic and moderate-complexity designs without external ASICs.
- On-chip memory capacity: Approximately 0.92 Mbits of embedded RAM reduces dependence on external memory for buffering and short-term storage.
- High I/O count: 335 I/O pins support wide parallel buses and multiple peripheral connections, simplifying board-level design.
- Stratix architecture features: Integrated clock networks, PLLs, and DSP-oriented resources provide design flexibility for timing and signal-processing tasks as described in the Stratix Device Handbook.
- Compact BGA package: 484-ball FCBGA (23×23) surface-mount package balances high pin count with space-efficient PCB integration.
- Manufacturing-friendly: RoHS compliance and standard commercial grade specification align with modern production and component sourcing practices.
Why Choose EP1S10F484C5?
The EP1S10F484C5 positions itself as a compact, FPGA-based solution for designs that require a balance of logic density, embedded memory, and a high number of I/O pins within a surface-mount BGA package. Its inclusion in the Stratix family means designers can reference established architecture and configuration features such as dedicated clocking resources and on-chip DSP/memory blocks documented in the Stratix Device Handbook.
This device is well suited to OEMs and engineering teams developing communications interfaces, signal-processing modules, or board-level controllers where commercial-grade temperature ratings and RoHS compliance are required. Choosing EP1S10F484C5 provides a scalable building block within the Stratix ecosystem for mid-range FPGA applications.
If you would like pricing, availability, or to request a formal quote for EP1S10F484C5, submit an inquiry or quote request to our sales team and include your desired quantities and application details.

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