EP1S10B672C7

IC FPGA 345 I/O 672BGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 345 920448 10570 672-BBGA

Quantity 623 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O345Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1S10B672C7 – Stratix® Field Programmable Gate Array (FPGA) IC 345 920448 10570 672-BBGA

The EP1S10B672C7 is a Stratix® FPGA manufactured by Intel. It delivers a mid-range combination of programmable logic, embedded memory, and high I/O count suitable for board-level integration where dense logic and on-chip RAM are required.

Built on the Stratix family architecture, this device provides 10,570 logic elements, approximately 0.92 Mbits of embedded memory, and 345 I/O pins in a 672-BBGA (35×35) surface-mount package. Its commercial grade temperature range and defined core supply make it appropriate for general embedded and communications-oriented designs.

Key Features

  • Logic capacity — 10,570 logic elements organized across 1,057 LABs, enabling mid-density programmable logic implementations.
  • Embedded memory — 920,448 total RAM bits (approximately 0.92 Mbits) for local data buffering and state storage.
  • I/O density — 345 I/O pins to support wide parallel interfaces and multiple external connections.
  • Package & mounting — 672-BBGA package (672-BGA, 35×35) with surface-mount assembly for compact board layouts.
  • Power — Core voltage supply range of 1.425 V to 1.575 V for defined power integration and regulator selection.
  • Operating conditions — Commercial grade operation from 0 °C to 85 °C.
  • Stratix architecture features — Device family documentation describes architecture elements such as TriMatrix memory, DSP block interface, PLLs and clock networks, and I/O structures including support for high-speed interfaces and advanced I/O control.
  • Configuration & test support — Stratix family documentation includes JTAG boundary-scan and embedded logic analysis capabilities suitable for development and manufacturing debug.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • High-density board I/O controllers — Use the 345 I/O pins and 672-BBGA package to implement complex parallel and multi-channel interfaces on a single FPGA.
  • Embedded logic and prototyping — 10,570 logic elements combined with on-chip RAM provide capacity for custom control logic, protocol engines, and rapid hardware prototyping.
  • Memory and external interface bridging — On-chip memory and the Stratix family’s external RAM interfacing capabilities support designs that mediate between external memory and application logic.
  • Signal-processing blocks — The Stratix architecture’s DSP interface and programmable logic are suited to implement custom arithmetic and data-path accelerators.

Unique Advantages

  • Balanced logic and memory — A combination of 10,570 logic elements and ~0.92 Mbits of embedded RAM lets designers allocate resources between control logic and data buffering without multiple devices.
  • High I/O integration — 345 I/O pins reduce the need for external multiplexing, simplifying board routing and connector requirements.
  • Compact, production-ready package — The 672-BBGA (35×35) surface-mount package offers dense integration for space-constrained boards.
  • Defined power envelope — A clear core supply range (1.425 V–1.575 V) simplifies power-supply design and validation.
  • Development and test capabilities — Family-level support for JTAG boundary-scan and embedded logic analysis assists debug, validation, and manufacturing test flows.
  • Regulatory and commercial readiness — Commercial temperature grading and RoHS compliance support mainstream product deployments and regulatory requirements.

Why Choose EP1S10B672C7?

The EP1S10B672C7 positions itself as a mid-density Stratix FPGA option that integrates a substantial logic fabric, nearly 1 Mbit of on-chip RAM, and a large set of I/O in a single 672-BBGA package. For teams designing embedded controllers, interface bridges, or custom DSP-accelerated functions, it provides a straightforward balance of capacity, I/O reach, and package density.

Manufactured by Intel and documented within the Stratix device handbook, this device is appropriate for projects that require predictable commercial-grade operation, clear power requirements, and on-board programmability backed by family-level configuration and test features.

Request a quote or submit a pricing inquiry for EP1S10B672C7 to receive current availability and lead-time details tailored to your project needs.

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