EP1M350F780I6N

The EP1M350F780I6N is a Mercury-series Field Programmable Gate Array (FPGA) offered in a 780-ball FCBGA package. It provides a mid-range logic density with 14,400 logic elements, 114,688 bits of on-chip RAM and up to 486 user I/O pins for integration in industrial applications.

Designed for industrial-grade environments, the device operates from a 1.71 V to 1.89 V supply and supports an operating temperature range of −40 °C to 100 °C, making it suitable for embedded control, signal-handling and I/O-intensive designs.

Key Features

• Logic Capacity — 14,400 logic elements provide the combinational and sequential resources needed for medium-complexity FPGA implementations.
• On-chip Memory — 114,688 bits of embedded RAM (approximately 0.115 Mbits) to support buffering, FIFOs and local data storage.
• I/O Density — Up to 486 user I/O pins to accommodate extensive peripheral and interface connectivity.
• Gate Equivalent — Approximately 350,000 gates for estimating overall design mapping and resource needs.
• Power — Core supply voltage range of 1.71 V to 1.89 V to match low-voltage FPGA system designs.
• Package and Mounting — 780-ball FCBGA package (780-FBGA, 29×29) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in temperature-challenging environments.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control — Implement custom logic for PLCs, motor-control interfaces and process automation where industrial temperature range and robust I/O count are required.
• Data Acquisition and Signal Conditioning — Use on-chip RAM and logic elements for buffering, preprocessing and real-time data handling from multiple sensors and ADC/DAC front ends.
• Embedded Interface Bridging — Bridge and aggregate multiple peripheral interfaces with the available 486 I/O pins for protocol conversion and system glue logic.
• Test & Measurement — Build configurable measurement and timing logic that leverages the device’s gate count and RAM for processing and temporary storage.

Unique Advantages

• Balanced Logic and Memory — 14,400 logic elements paired with approximately 0.115 Mbits of embedded RAM supports both control logic and modest data buffering in a single device.
• High I/O Capacity — 486 I/O pins simplify board-level connectivity and reduce the need for external I/O expanders.
• Industrial-ready Thermal Range — Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact FCBGA Package — 780-FBGA (29×29) enables high-density, surface-mount board designs while keeping a small footprint.
• Low-voltage Operation — Core supply from 1.71 V to 1.89 V aligns with modern low-voltage system rails.
• RoHS Compliance — Supports lead-free assembly and environmental compliance requirements.

Why Choose EP1M350F780I6N?

The EP1M350F780I6N delivers a practical combination of logic density, on-chip memory and high I/O count in a single industrial-grade FPGA package. Its 14,400 logic elements, substantial user I/O and compact 780-FBGA footprint make it a strong choice for embedded designers who need mid-range programmable logic with industrial temperature tolerance.

This device suits customers designing control systems, interface bridges and data acquisition solutions that require a balance of integration, board-level I/O and deterministic operating range. Its RoHS compliance and surface-mount FCBGA packaging support modern manufacturing and assembly workflows.

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