EP1M350F780C5
| Part Description |
Mercury Field Programmable Gate Array (FPGA) IC 486 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,315 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 486 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1440 | Number of Logic Elements/Cells | 14400 | ||
| Number of Gates | 350000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of EP1M350F780C5 – Mercury Field Programmable Gate Array (FPGA) IC 486 780-BBGA, FCBGA
The EP1M350F780C5 is a Mercury-series Field Programmable Gate Array (FPGA) from Altera designed for configurable digital logic applications. It provides a balance of logic density, on-chip memory, and high I/O count in a 780-ball FCBGA package for surface-mount applications.
With 14,400 logic elements, approximately 0.11 Mbits of embedded memory, and 486 I/O pins, this commercial-grade device supports I/O-rich designs that require flexible, reprogrammable logic at supply voltages between 1.71 V and 1.89 V and an operating range of 0 °C to 85 °C.
Key Features
- Logic Capacity — 14,400 logic elements and approximately 350,000 gates provide the programmable resources for custom digital functions and logic implementation.
- Embedded Memory — Total on-chip RAM of 114,688 bits (approximately 0.11 Mbits) for buffering, state storage, and intermediate data processing.
- I/O Density — 486 user I/O pins enable interface consolidation and support designs with numerous external signals or parallel interfaces.
- Power Supply — Operates from 1.71 V to 1.89 V to match systems that use low-voltage core rails.
- Package and Mounting — 780-BBGA FCBGA package (supplier package: 780-FBGA, 29 × 29 mm) optimized for surface-mount assembly in compact board layouts.
- Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard environmental conditions.
- Regulatory — RoHS compliant to meet contemporary material-restriction requirements.
Typical Applications
- Custom digital logic — Implement bespoke state machines, data paths, and control logic using the device's 14,400 logic elements and embedded memory.
- High-density I/O interfaces — Consolidate multiple peripheral or sensor interfaces with the 486 available I/O pins for board-level integration.
- Prototyping and development — Use the reprogrammable FPGA fabric for iterative development of digital systems where frequent design changes are required.
- Embedded data buffering — Leverage approximately 0.11 Mbits of on-chip RAM for temporary storage and data alignment in streaming or packetized designs.
Unique Advantages
- Balanced logic and memory — Combines 14,400 logic elements with approximately 0.11 Mbits of RAM to support mid-range digital designs without external memory for many tasks.
- High I/O count — 486 I/Os reduce the need for external I/O expanders and simplify board-level signal routing for I/O-intensive applications.
- Compact BGA package — 780-ball FCBGA (29 × 29 mm) enables high pin density in a space-efficient surface-mount form factor.
- Low-voltage core compatibility — 1.71 V to 1.89 V supply range suits systems using modern low-voltage logic rails.
- RoHS compliant — Meets material compliance expectations for contemporary manufacturing and supply chains.
Why Choose EP1M350F780C5?
The EP1M350F780C5 delivers a practical combination of programmable logic, embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for I/O-rich, mid-density FPGA designs in commercial environments. Its specification set supports designers who need a reconfigurable platform with a clear balance of resources and package density.
This device is appropriate for development teams and product designs that prioritize flexible digital integration, on-chip buffering, and a high number of external interfaces, all while adhering to RoHS material requirements and standard commercial temperature ranges.
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