EP1M120F484C6

The EP1M120F484C6 is a Mercury family field-programmable gate array (FPGA) from Intel featuring a look-up-table (LUT)-based architecture optimized for high-speed logic and routing. It integrates on-chip memory and dedicated DSP and transceiver resources to support data-path, register‑intensive, and communications-oriented designs.

With 4,800 logic elements, approximately 49,152 bits of embedded RAM (12 ESBs), 303 user I/Os, and integrated high-speed transceivers, this commercial-grade device targets applications that require moderate FPGA capacity with advanced I/O and timing resources in a 484‑ball FineLine BGA package.

Key Features

• Core Logic  4,800 logic elements delivering approximately 120,000 typical gates for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM organized in 12 embedded system blocks (ESBs); each ESB contains 4,096 bits and can be partitioned for flexible RAM or FIFO configurations.
• High‑Speed Transceivers  Integrated high-speed differential transceivers with clock-data recovery (CDR) support up to 1.25 Gbps and 8 HSDI channels on the EP1M120 device.
• I/O Standards & Throughput  Enhanced I/O structure with broad standard support (including LVTTL, PCI up to 66 MHz, SSTL, GTL+, HSTL, CTT, LVDS, LVPECL, and PCML) and flexible LVDS/True‑LVDS support for source‑synchronous interfaces.
• Clocking & DSP  Up to four general-purpose phase-locked loops (PLLs) for clock multiplication and deskew, and dedicated multiplier circuitry capable of implementing signed or unsigned 16 × 16 multiplications for DSP acceleration.
• Interconnect & Arithmetic  FastTrack interconnect structure with dedicated carry chains and FastLUT/Leap line resources for predictable routing and optimized arithmetic performance.
• Package & Power  484‑ball FineLine BGA (484‑FBGA, 23 × 23) surface-mount package; core supply range 1.71 V to 1.89 V (nominal 1.8 V internal supply described in documentation).
• Commercial Grade & Compliance  Commercial operating temperature range 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High‑Speed Communications  Use the integrated transceivers with CDR and LVDS/LVPECL I/O support for serialized link interfaces, protocol bridging, and board-level data aggregation.
• Digital Signal Processing  Leverage the dedicated multipliers, embedded RAM, and fast interconnect for DSP kernels such as filters, FFTs, and math-intensive datapaths.
• Networking & I/O Bridging  Deploy as an interface/bridge device handling multiple standards and source‑synchronous channels thanks to flexible I/O standards and plentiful user I/O pins (303).
• Prototyping & System Integration  Ideal for system-level prototyping where moderate logic density, on‑chip memory, and mixed I/O support are required in a compact FCBGA package.

Unique Advantages

• Balanced Logic and Memory Mix:  4,800 logic elements combined with 12 ESBs (≈49,152 bits) provide an integrated platform for control logic plus embedded memory without external SRAM in many designs.
• Integrated High‑Speed I/O:  Built-in HSDI transceivers with CDR to 1.25 Gbps simplify high-speed serial interface designs and reduce external SERDES components.
• Flexible Clocking and DSP Support:  Multiple PLLs and dedicated multipliers enable precise clock management and efficient implementation of arithmetic and DSP functions.
• Rich I/O Standard Support:  Broad compatibility with common voltage and signaling standards reduces interface translation hardware and accelerates system integration.
• Compact, Surface‑Mount Package:  484‑ball FineLine BGA (23 × 23) provides high I/O density in a package suited to compact, board‑level designs.
• Compliance and Commercial Availability:  RoHS compliant and specified for 0 °C to 85 °C operation for commercial deployments.

Why Choose EP1M120F484C6?

The EP1M120F484C6 positions itself as a performance‑focused Mercury family FPGA option that combines moderate logic capacity with substantial on‑chip RAM, dedicated DSP resources, and integrated high‑speed transceivers. It is suited to engineers who need a compact, surface‑mount device with extensive I/O and flexible clocking for communications, DSP, and system‑level interface tasks.

Backed by Intel (Mercury family) device architecture and documented routing/clocking resources, this part offers a predictable hardware platform for designs that require a balance of logic, memory, and high‑speed I/O in a 484‑ball FCBGA package.

If you would like pricing, availability, or to request a quote for EP1M120F484C6, please submit an inquiry or request a quotation through your preferred procurement channel.