EP1K50TC144-3N

The EP1K50TC144-3N is an ACEX-1K series field programmable gate array (FPGA) packaged in a 144-pin LQFP/TQFP form factor. It combines a programmable logic array with embedded memory blocks to support mid-density integration tasks where on-chip memory, flexible I/O, and reconfigurability are required.

Designed for commercial-temperature applications, this device targets cost-sensitive system-on-programmable-chip (SOPC) use cases such as communications interfaces, embedded buffering, and general-purpose logic consolidation, offering a balance of logic capacity, embedded RAM, and I/O count.

Key Features

• Core Logic — 2,880 logic elements (LEs) providing the configurable fabric for combinational and sequential logic; approximately 199,000 system gates.
• Embedded Memory — Total on-chip RAM of 40,960 bits, supported by the ACEX-1K embedded array blocks (EABs) and dual-port capability for efficient memory and buffering functions.
• I/O and Voltage — 102 user I/O pins; device operates with an internal 2.5 V supply and a specified voltage supply range of 2.375 V to 2.625 V for core/IO management.
• Configuration and Test — In-circuit reconfigurability options and built-in JTAG boundary-scan test (IEEE 1149.1) for board-level test and debug without consuming additional logic.
• Arithmetic and Interconnect — Dedicated carry and cascade chains plus a flexible interconnect architecture to implement fast adders, counters, and high-fan-in logic.
• Package & Mounting — Surface-mount package in 144-LQFP (supplier package listed as 144-TQFP, 20 × 20 mm) for compact board designs.
• Operating Range & Compliance — Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS compliance for environmental regulation support.

Typical Applications

• Communications Interfaces — Implement protocol bridging, packet buffering or custom interface logic using the device’s embedded RAM and flexible I/O.
• Embedded Memory and Buffering — Use dual-port EABs for FIFO, small SRAM emulation, or scratchpad memory in data-path designs.
• Logic Consolidation — Replace discrete glue logic and small PLDs with a single FPGA to reduce board complexity and component count.
• Peripheral and Sensor Interfacing — Control and aggregate multiple peripheral signals, leveraging programmable I/O and per-pin output control options.

Unique Advantages

• Balanced Logic and Memory: 2,880 logic elements paired with 40,960 bits of embedded RAM enable combined logic and buffering functions without external memory in many designs.
• On-board Testability: Built-in JTAG boundary-scan simplifies board bring-up and manufacturing test without consuming user logic resources.
• Flexible Interconnect and Arithmetic Support: Dedicated carry and cascade chains accelerate implementation of arithmetic and high fan-in functions, improving performance for common logic patterns.
• Compact Surface-Mount Packaging: 144-pin LQFP/TQFP footprint enables integration into space-constrained PCBs while providing a substantial number of I/O pins for mid-range designs.
• Commercial Temperature Grade: Rated for 0 °C to 70 °C operation, appropriate for general-purpose commercial applications and controlled-environment systems.

Why Choose EP1K50TC144-3N?

The EP1K50TC144-3N positions itself as a cost-efficient, mid-density FPGA option within the ACEX-1K family, offering a practical mix of logic elements, embedded RAM, and programmable I/O in a compact LQFP/TQFP package. It is suitable for engineers looking to consolidate logic, implement small on-chip memories, or add reconfigurable interfaces without moving to larger or more costly device classes.

Supported by ACEX-1K family-level features such as in-circuit reconfigurability, JTAG test, and dedicated arithmetic resources, this device provides scalable integration for commercial designs that require reliable programmability and on-chip memory resources.

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