EP1K50TC144-1N

IC FPGA 102 I/O 144TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 229 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50TC144-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

The EP1K50TC144-1N is an ACEX 1K family programmable logic device (PLD) in a 144-pin LQFP surface-mount package. It combines a mid-density logic array with embedded memory blocks and flexible I/O to support system-on-a-programmable-chip (SOPC) integration for commercial applications.

Designed for cost-efficient integration, the device targets communications and general-purpose commercial designs that require moderate logic capacity, on-chip RAM, and versatile interface options while operating in a standard commercial temperature range.

Key Features

  • Logic Capacity — 2,880 logic elements providing approximately 199,000 system gates for mid-density logic integration.
  • Embedded Memory — Approximately 40,960 bits of total on-chip RAM implemented across embedded array blocks (EABs).
  • Embedded Array Blocks (EABs) — ACEX 1K family architecture includes dedicated EABs enabling dual-port memory implementations and specialized logic megafunctions.
  • I/O Density & Flexibility — 102 user I/O pins with MultiVolt I/O capability that can interface with 2.5-V, 3.3-V, or 5.0-V devices (series-level feature).
  • Clock & Arithmetic Support — Built-in low-skew clock distribution, dedicated carry and cascade chains, and up to six global clock signals to support high-fan-in and fast arithmetic functions (series-level features).
  • Configuration & Test — In-circuit reconfigurability (ICR) options and JTAG boundary-scan (IEEE Std. 1149.1) support for programming and board-level test.
  • Package & Mounting — 144-LQFP (supplier package 144-TQFP, 20×20 mm) surface-mount package suitable for compact PCB designs.
  • Electrical & Environmental — Operating supply range 2.375 V to 2.625 V (2.5-V internal supply) and commercial operating temperature 0 °C to 70 °C. RoHS compliant.

Typical Applications

  • Communications Interfaces — Mid-density packet processing, protocol bridging, or peripheral interfaces that benefit from on-chip memory and flexible I/O.
  • SOPC Integration — System-on-a-programmable-chip implementations where embedded RAM and logic elements are used to integrate control and datapath functions on a single device.
  • PCI-Compatible Peripherals — Series-level support for PCI Local Bus Specification operation (3.3-V operation at standard speeds) for peripheral or add-on card logic.
  • Embedded Control — Commercial embedded controllers and moderate-complexity state machines leveraging in-circuit reconfigurability and built-in clock resources.

Unique Advantages

  • Balanced Mid-Density Integration: 2,880 logic elements and ~199,000 gates deliver a practical balance of logic and routing for many commercial designs without over-provisioning.
  • Significant On-Chip RAM: Approximately 40,960 bits of embedded RAM across EABs reduce external memory needs for buffers, FIFOs, and small look-up tables.
  • MultiVolt I/O Flexibility: I/O that supports multiple voltage domains simplifies interfacing to a range of peripheral devices and legacy logic levels (series-level capability).
  • Programmability and Testability: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan provide streamlined development, deployment, and board-level test flows.
  • Compact, Surface-Mount Package: 144-LQFP surface-mount package offers a compact footprint for space-constrained PCBs while maintaining moderate I/O availability.
  • Toolchain and Migration Support: ACEX 1K family design support enables common design flows and package pin compatibility options across the series for board-level migration.

Why Choose EP1K50TC144-1N?

The EP1K50TC144-1N positions itself as a cost-efficient, mid-density programmable logic option for commercial designs that require a blend of logic elements, embedded RAM, and flexible I/O in a compact surface-mount package. Its ACEX 1K family architecture delivers embedded array blocks, dedicated arithmetic and cascade chains, and series-level system features that simplify integration of SOPC-style functions and communications interfaces.

This device is well suited to engineers designing commercial products who need moderate logic capacity, on-chip memory, and in-system programmability, backed by documented family-level features and toolchain support for efficient development and board-level testing.

Request a quote or submit an inquiry to receive pricing and availability for EP1K50TC144-1N and to discuss how it fits your design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up