EP1K50QI208-2N

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

Quantity 386 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50QI208-2N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

The EP1K50QI208-2N is an ACEX-1K series field programmable gate array (FPGA) from Intel, delivering a balance of programmable logic, embedded memory, and flexible I/O in a compact surface-mount package. It combines on-chip embedded array blocks with a general logic array to implement megafunctions, memory, and control logic for system-level integration.

This device is suited for industrial designs that require mid-range logic density, dedicated embedded RAM, and a wide operating temperature range. Key value comes from its configurable I/O flexibility, in-circuit reconfigurability, and a compact 208-pin BFQFP package for space-constrained boards.

Key Features

  • Logic Capacity  Approximately 2,880 logic elements and 199,000 maximum system gates provide mid-range programmable logic for control, glue logic, and custom datapath functions.
  • Embedded Memory (EABs)  Total on-chip RAM of 40,960 bits implemented via embedded array blocks (EABs), featuring dual-port capability with up to 16-bit width per EAB for efficient memory and megafunction implementations.
  • I/O and Voltage Flexibility  147 user I/O pins with MultiVolt I/O capability (series-level) to interface with multiple voltage domains; operates with a 2.5-V internal supply and device VCC range of 2.375 V to 2.625 V.
  • Package and Mounting  208-BFQFP surface-mount package (supplier package listed as 208-PQFP 28×28) for PCB space optimization and easy assembly.
  • Industrial Temperature Grade  Specified operating range from −40 °C to 85 °C, suitable for industrial-environment deployments.
  • Configuration and Test  Supports in-circuit reconfigurability (ICR) and includes built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1 for board-level test and programming.
  • Clocking and Performance Options  Series-level features include built-in low-skew clock distribution, options like ClockLock and ClockBoost, and up to six global clock signals for complex timing architectures; bidirectional I/O setup and clock-to-output performance available up to 250 MHz (series specification).
  • Routing and Arithmetic Support  FastTrack interconnect, dedicated carry chains, and cascade chains enable predictable routing delays and efficient implementation of adders, counters, and high-fan-in logic (series-level).
  • Regulatory and Environmental  RoHS compliant.

Typical Applications

  • Communications and Networking  Implement protocol glue logic, packet buffering using embedded RAM, and custom packet-processing functions in mid-density communications equipment.
  • System-on-a-Chip (SOPC) Integration  Combine control logic, small embedded memories, and interface glue to create compact SOPC solutions for industrial controllers and instrumentation.
  • Industrial Control  Drive motor controllers, sensor aggregation, and deterministic control logic where industrial temperature range and configurable I/O are required.
  • Custom Interfaces and Peripherals  Implement bridging logic, timing-critical interfaces, and small-scale data buffering for peripheral devices in embedded systems.

Unique Advantages

  • Balanced Mid-Range Integration:  Combines 2,880 logic elements with 40,960 bits of embedded RAM to implement control logic and local data storage without external memory.
  • Flexible I/O Voltage Options:  MultiVolt I/O capability (series-level) and 147 I/O pins let you interface multiple voltage domains, reducing the need for level-shifting components.
  • Industrial Reliability:  Industrial-grade temperature range (−40 °C to 85 °C) supports deployment in harsh environments.
  • Board-Level Test and Reconfiguration:  Built-in JTAG boundary-scan and in-circuit reconfigurability simplify manufacturing test, deployment, and field updates.
  • Predictable Timing and Arithmetic Support:  Dedicated carry and cascade chains plus low-skew clocking options help implement high-speed arithmetic and synchronous logic with predictable timing.
  • Compact, Assembly-Friendly Package:  208-pin BFQFP in a surface-mount form factor enables compact PCB layouts and conventional assembly processes.

Why Choose EP1K50QI208-2N?

The EP1K50QI208-2N delivers a practical mix of programmable logic, embedded RAM, and flexible I/O in a compact industrial-grade package. It is well suited for engineers designing mid-density FPGA solutions that require on-chip memory, configurable interfaces, and in-circuit reconfigurability for field updates and testability.

Chosen for designs where integration, predictable timing structures, and industrial temperature operation matter, this ACEX-1K device provides a clear migration path within the family and leverages series-level features such as dedicated arithmetic chains and low-skew clock distribution to simplify implementation of control and data-path logic.

Request a quote or submit an inquiry to receive pricing and availability details for EP1K50QI208-2N and to discuss how this device fits your design requirements.

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