EP1K50TC144-3

IC FPGA 102 I/O 144TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 102 40960 2880 144-LQFP

Quantity 363 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50TC144-3 – ACEX-1K® Field Programmable Gate Array (FPGA), 2,880 Logic Elements, 40,960-bit RAM, 144-LQFP

The EP1K50TC144-3 is an ACEX-1K series field programmable gate array (FPGA) designed for commercial-grade system-on-a-programmable-chip integration. It combines 2,880 logic elements, embedded memory, and flexible I/O to address control, interface, and logic-acceleration tasks in communications and embedded designs.

This surface-mount device is supplied in a 144-LQFP package and operates from a core supply range of 2.375 V to 2.625 V with an operating temperature range of 0 °C to 70 °C, making it suited to mainstream commercial embedded applications.

Key Features

  • Logic Core  2,880 logic elements and a maximum system gate count of 199,000 provide a programmable fabric for implementing medium-density logic and glue functions.
  • Embedded Memory  Total on-chip RAM of 40,960 bits (approximately 40.96 kbits) supports data buffering, small on-chip FIFOs, and memory-mapped megafunctions.
  • I/O and Voltage  102 user I/O pins with MultiVolt capability (family-level support for driving/receiving multiple I/O voltages) and a device core supply range of 2.375 V–2.625 V.
  • Package & Mounting  144-LQFP (supplier package listed as 144-TQFP 20×20) in a surface-mount form factor for compact board designs.
  • Configuration and Test  In-circuit reconfigurability and JTAG boundary-scan test (IEEE 1149.1) support enable programmable updates and standard structural testability without consuming device logic.
  • Clocking and Performance Options  Family-level features include low-skew clock distribution, ClockLock and ClockBoost options for reduced clock delay and skew, and up to six global clock signals for complex timing domains.
  • Flexible Interconnect & Arithmetic Support  Dedicated carry and cascade chains plus a continuous routing interconnect enable efficient implementation of adders, counters, and high-fan-in logic functions.
  • Compliance & Environmental  Commercial-grade device with RoHS compliance and an operating range of 0 °C to 70 °C.

Typical Applications

  • Communications Interfaces  Implement protocol bridging, packet buffering, and peripheral interface logic leveraging embedded RAM and dedicated arithmetic chains.
  • Embedded Control & Glue Logic  Replace or consolidate discrete control logic and state machines with programmable logic for faster time-to-market and simplified BOM.
  • Memory and Buffering Functions  Use the device’s embedded RAM blocks for small dual-port buffers, FIFOs, and packet queues in data-path designs.
  • Prototyping and Low-Volume Production  Ideal for developing and validating custom logic in commercial products where reprogrammability and integration are required.

Unique Advantages

  • Compact, integrated FPGA solution: 2,880 logic elements and on-chip RAM reduce external components and simplify board design.
  • MultiVolt I/O flexibility: I/O architecture supports interfacing with different voltage domains, easing integration with mixed-voltage systems.
  • In-circuit reconfigurability and JTAG test: Field updates and standardized boundary-scan testability streamline development and manufacturing diagnostics.
  • Dedicated arithmetic and cascade chains: Hardware support for adders, counters, and high-fan-in logic yields efficient implementation of common functions.
  • Commercial temperature and RoHS compliance: Suitable for mainstream commercial products and environmentally compliant deployments.

Why Choose EP1K50TC144-3?

The EP1K50TC144-3 positions itself as a medium-density, commercially rated FPGA that balances logic capacity, embedded memory, and flexible I/O in a compact 144-LQFP surface-mount package. It is well suited to designers who need programmable integration for communications interfaces, control logic, and embedded buffering without moving to larger or higher-cost FPGA families.

With in-circuit reconfigurability, JTAG test support, and a family of architecture features such as dedicated carry/cascade chains and low-skew clocking options, this device supports iterative development and reliable deployment in commercial embedded systems.

Request a quote or submit an inquiry to get pricing, availability, and support information for EP1K50TC144-3. Our team can assist with technical details and ordering for your project needs.

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