EP1M120F484C7

IC FPGA 303 I/O 484FBGA
Part Description

Mercury Field Programmable Gate Array (FPGA) IC 303 49152 4800 484-BBGA, FCBGA

Quantity 1,161 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O303Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4800
Number of Gates120000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1M120F484C7 – Mercury Field Programmable Gate Array (FPGA)

The EP1M120F484C7 is a Mercury-series FPGA optimized for high-performance, register‑intensive and data‑path applications. It pairs a LUT-based architecture with embedded memory and dedicated signal-processing resources to support communications, DSP and custom logic functions.

Key on-chip resources include approximately 4,800 logic elements, about 49,152 bits of embedded RAM, and up to 303 user I/O pins, packaged in a 484‑ball FineBall Grid Array (FBGA) for surface-mount systems. The device is RoHS compliant and specified for commercial temperature operation.

Key Features

  • Core Architecture  LUT-based logic architecture with approximately 4,800 logic elements and roughly 120,000 typical gates for implementing complex digital functions.
  • Embedded Memory  Approximately 49,152 bits of on-chip RAM delivered via embedded system blocks (ESBs) that can be split for multiple RAM configurations.
  • Dedicated DSP Resources  Built-in multiplier circuitry for high-speed signed/unsigned multiplication up to 16 × 16, supporting arithmetic and signal‑processing workloads.
  • High-speed Transceivers & I/O  Integrated high-speed transceivers with support for clock data recovery (CDR) up to 1.25 Gbps and flexible I/O elements supporting standards such as LVDS, LVPECL, LVTTL, SSTL, GTL+, HSTL and others.
  • Clocking & System Control  Up to four general-purpose PLLs with programmable multiplication and delay shifting and multiple PLL output ports for complex clocking schemes.
  • Interconnect & Performance  Advanced multi-level interconnect structure including dedicated carry chains and high-speed routing resources for predictable, fast signal paths.
  • Power & Supply  Internal supply voltage around 1.8 V (device VCCINT range 1.71 V to 1.89 V as specified) for low-power core operation.
  • Package & Temperature  Surface-mount 484‑BBGA (FCBGA) / 484‑FBGA (23×23) package; commercial grade operation from 0 °C to 85 °C.
  • Standards & Reliability  RoHS compliant and designed with IO elements that support a wide range of interface standards and built-in termination on high-speed differential pairs.

Typical Applications

  • High‑speed Communications  Implement serial links and protocol bridging using integrated transceivers and CDR support for multi‑hundred‑Mbps to gigabit signaling.
  • Digital Signal Processing  Use dedicated multipliers and embedded RAM for FIR filters, FFTs and other DSP kernels requiring efficient arithmetic and memory.
  • Data‑Path and Math‑Intensive Logic  Leverage the LUT architecture, carry chains and fast interconnect for adders, comparators and pipeline compute blocks.
  • Custom Interface & Board Control  Implement flexible I/O interfaces and source‑synchronous links for memory controllers, board management and peripheral glue logic.

Unique Advantages

  • Balanced resource mix: Combines logic, embedded RAM and multipliers to consolidate DSP and control functions into a single device.
  • Integrated high‑speed I/O: On‑chip transceivers with CDR and built‑in differential termination simplify high‑speed link design and reduce external components.
  • Flexible clocking: Multiple PLLs and numerous clock outputs enable complex clock-domain management without extensive external circuitry.
  • Predictable performance: Fast routing resources, dedicated carry chains and optimized interconnect help maintain timing for critical paths.
  • Compact surface‑mount package: 484‑ball FBGA (23×23) supports dense board layouts while offering up to 303 user I/O pins.
  • Standards support and compatibility: IO elements support a broad set of interface standards to ease integration with diverse subsystems.

Why Choose EP1M120F484C7?

The EP1M120F484C7 positions itself as a versatile Mercury‑series FPGA for designers who need a compact, performance‑oriented device with integrated memory and DSP‑friendly resources. Its combination of roughly 4,800 logic elements, embedded RAM, dedicated multipliers and robust I/O capabilities makes it suitable for communication endpoints, DSP accelerators and complex control logic within commercial temperature ranges.

With advanced clocking, high‑speed transceiver support, and a dense 484‑ball FBGA package, this device offers a balanced solution for system integrators seeking to reduce component count while retaining flexible interface and processing options, backed by RoHS compliance.

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