EP1M350F780I6

The EP1M350F780I6 is an Intel Mercury family Field Programmable Gate Array (FPGA) optimized for high-performance, register‑intensive, and communications-focused designs. It uses a LUT-based architecture with a fast interconnect structure and integrated high-speed transceiver circuitry to address demanding data-path, DSP, and interface applications.

With 14,400 logic elements, approximately 114,688 bits of embedded memory, up to 486 user I/O pins and dedicated high-speed I/O channels, this industrial-grade device balances integration and performance for embedded systems and high-speed interfaces.

Key Features

• Core architecture — LUT-based design with fast, multi-level FastTrack interconnect and dedicated carry chains for efficient arithmetic and data-path implementations.
• Logic density — 14,400 logic elements (LEs) and a typical logic capacity of 350,000 gates for complex logic and control functions.
• Embedded memory — Approximately 114,688 bits of on-chip RAM delivered via 28 Embedded System Blocks (ESBs), each 4,096 bits and configurable into smaller RAM blocks for FIFOs, dual-port RAM, or CAM structures.
• High-speed I/O and transceivers — Up to 18 HSDI channels with integrated serializer/deserializer and clock data recovery (CDR) support to 1.25 Gbps; Flexible-LVDS support up to 624 Mbps on large channel counts.
• I/O standards & flexibility — Robust support for LVTTL, LVDS, LVPECL, GTL+, HSTL, SSTL-2/3, CTT, PCML and source-synchronous True-LVDS; three-register I/O elements support DDR and multi-rate SRAM interfaces.
• Clocking & DSP support — Up to four general-purpose PLLs with programmable multiplication and delay shifting and dedicated multiplier circuitry for up to 16 × 16 multiplication.
• Power & voltage — Internal supply around 1.8 V with external voltage compatibility; device voltage supply specified 1.71 V to 1.89 V for VCCINT.
• Package & grade — Surface-mount 780-BBGA FCBGA (supplier package: 780-FBGA, 29 × 29); rated for industrial temperature operation from −40 °C to 100 °C.
• Standards & compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-speed communications — Use the integrated HSDI transceivers with CDR and LVDS/LVPECL support for serializer/deserializer interfaces and link-layer implementations.
• Digital signal processing — Dedicated multiplier circuitry and abundant logic elements make the device suitable for DSP algorithms, filtering, and math‑intensive blocks.
• Memory and interface bridging — On-chip ESBs and versatile I/O elements enable DDR/DDRII-style memory interfaces, FIFOs, and multi-port RAM emulation for buffering and protocol bridging.
• Data-path and control logic — Fast interconnect, dedicated carry chains, and abundant LEs suit wide datapath designs, packet processing, and control-plane functions.

Unique Advantages

• Integrated high-speed transceivers: On-chip HSDI channels with CDR to 1.25 Gbps reduce external SerDes components for cleaner board-level designs.
• Rich I/O standard support: Broad compatibility with popular single-ended and differential standards simplifies interfacing to peripherals, memory, and high-speed links.
• Configurable embedded memory: 28 ESBs (4,096 bits each) deliver flexible on-chip RAM that can be partitioned for FIFOs, dual-port RAM, or CAM use cases, reducing external memory needs.
• Deterministic clocking: Up to four PLLs with multiple outputs provide flexible clock management for multi-rate systems and synchronous data-paths.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Surface-mount BGA packaging: 780-BBGA (29 × 29) package delivers high I/O density while supporting standard surface-mount assembly processes.

Why Choose EP1M350F780I6?

The EP1M350F780I6 positions itself as a high-density, high‑I/O Mercury-family FPGA suited for communications, DSP, and complex data-path applications. Its combination of 14,400 logic elements, substantial embedded memory, multiple PLLs, and integrated high-speed transceivers enables developers to consolidate functions, reduce board-level components, and implement multi-protocol interfaces on a single device.

Designed for industrial deployment with RoHS compliance and a −40 °C to 100 °C operating range, this packaged FPGA offers a balance of performance, integration, and configurability for engineering teams building scalable embedded systems and interface-intensive products.

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