EP1S80F1020I7N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 773 7427520 79040 1020-BBGA |
|---|---|
| Quantity | 729 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 773 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7904 | Number of Logic Elements/Cells | 79040 | ||
| Number of Gates | N/A | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7427520 |
Overview of EP1S80F1020I7N – Stratix® Field Programmable Gate Array (FPGA) IC 773 7427520 79040 1020-BBGA
The EP1S80F1020I7N is an industrial-grade Stratix FPGA offering a high-density logic fabric and substantial on-chip memory for complex, programmable digital designs. Built on the Stratix device family architecture, it pairs approximately 79,040 logic elements with advanced family-level features such as flexible memory modes, PLL-based clocking, and high-speed I/O support for demanding embedded and industrial applications.
With 773 user I/Os, about 7.4 Mbits of embedded memory, and a 1020-ball BGA package, this device targets systems that require large logic capacity, broad external connectivity, and robust operating range from −40 °C to 100 °C. The device operates at a core supply between 1.425 V and 1.575 V and is offered in an industrial grade package for use in temperature-challenging environments.
Key Features
- High Logic Capacity — Approximately 79,040 logic elements provide the resources for large-scale custom logic, complex state machines, and parallel datapaths.
- Large Embedded Memory — Approximately 7.4 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage close to logic for low-latency processing.
- Extensive I/O Count — 773 user I/Os available for broad external interface options and high pin-count system integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet harsh-environment requirements.
- Core Voltage — Specified core supply range of 1.425 V to 1.575 V for precise power-domain design.
- Package — 1020-ball BGA (supplier package: 1020-FBGA, 33 × 33 mm) enables high pin density in a compact footprint.
- Clocking & Timing — Family-level documentation highlights comprehensive PLL and clock network support for complex clocking schemes and synchronous system designs.
- Advanced I/O Architecture — Stratix family features include high-speed differential I/O support, DDR I/O capabilities, and programmable I/O controls for interfacing with a wide range of external devices.
- Configuration & Test Support — Family documentation references JTAG boundary-scan and embedded logic analysis capabilities for in-system test, configuration, and debug.
- RoHS Compliant — Device meets current RoHS environmental requirements.
Typical Applications
- Industrial Control & Automation — Industrial-grade temperature rating and high I/O count enable robust control, sensor aggregation, and real-time logic in factory and process automation.
- High-Density Digital Processing — Large logic element count and significant on-chip RAM make the device suitable for complex custom datapaths, protocol processing, and hardware acceleration tasks.
- High-Speed Interfaces & Networking — Extensive I/O and family-level high-speed differential I/O support fit applications requiring numerous physical interfaces and precise clocking (PLLs & clock networks).
- Embedded Memory Buffering — Approximately 7.4 Mbits of embedded RAM supports packet buffering, frame storage, and local scratchpad memory for throughput-centric designs.
Unique Advantages
- High Integration Density: Large logic and memory resources reduce the need for external ASICs or multiple FPGAs, simplifying system BOM and board complexity.
- Broad Connectivity: 773 I/Os and advanced I/O architecture allow designers to support many peripherals and high-pin-count interfaces from a single device.
- Industrial Reliability: Specified operation from −40 °C to 100 °C and industrial-grade classification support deployment in temperature-challenging environments.
- Flexible Clocking: Family-level PLLs and clock networks enable precise clock domain management and high-performance synchronous designs.
- Test and Configuration Tooling: Built-in JTAG and embedded logic analysis capabilities (referenced in family documentation) streamline development, in-system test, and debug.
Why Choose EP1S80F1020I7N?
The EP1S80F1020I7N combines substantial logic capacity, significant on-chip memory, and a high I/O count in a 1020-ball BGA package targeted at industrial applications. Its electrical and thermal ratings, together with the Stratix family’s documented clocking, memory, and I/O capabilities, make it a strong option for designers needing a scalable, highly connected programmable device for complex digital systems.
This device is well suited to engineering teams building high-density custom logic, embedded processing, or connectivity-rich systems that require robust temperature performance and ample on-chip resources. Backed by extensive Stratix family documentation, it supports disciplined development, testing, and deployment workflows.
Request a quote or submit an RFQ to receive pricing and lead-time information for EP1S80F1020I7N and to discuss how this device can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018