EP1S80F1020I7N

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 7427520 79040 1020-BBGA

Quantity 729 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7904Number of Logic Elements/Cells79040
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7427520

Overview of EP1S80F1020I7N – Stratix® Field Programmable Gate Array (FPGA) IC 773 7427520 79040 1020-BBGA

The EP1S80F1020I7N is an industrial-grade Stratix FPGA offering a high-density logic fabric and substantial on-chip memory for complex, programmable digital designs. Built on the Stratix device family architecture, it pairs approximately 79,040 logic elements with advanced family-level features such as flexible memory modes, PLL-based clocking, and high-speed I/O support for demanding embedded and industrial applications.

With 773 user I/Os, about 7.4 Mbits of embedded memory, and a 1020-ball BGA package, this device targets systems that require large logic capacity, broad external connectivity, and robust operating range from −40 °C to 100 °C. The device operates at a core supply between 1.425 V and 1.575 V and is offered in an industrial grade package for use in temperature-challenging environments.

Key Features

  • High Logic Capacity — Approximately 79,040 logic elements provide the resources for large-scale custom logic, complex state machines, and parallel datapaths.
  • Large Embedded Memory — Approximately 7.4 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage close to logic for low-latency processing.
  • Extensive I/O Count — 773 user I/Os available for broad external interface options and high pin-count system integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet harsh-environment requirements.
  • Core Voltage — Specified core supply range of 1.425 V to 1.575 V for precise power-domain design.
  • Package — 1020-ball BGA (supplier package: 1020-FBGA, 33 × 33 mm) enables high pin density in a compact footprint.
  • Clocking & Timing — Family-level documentation highlights comprehensive PLL and clock network support for complex clocking schemes and synchronous system designs.
  • Advanced I/O Architecture — Stratix family features include high-speed differential I/O support, DDR I/O capabilities, and programmable I/O controls for interfacing with a wide range of external devices.
  • Configuration & Test Support — Family documentation references JTAG boundary-scan and embedded logic analysis capabilities for in-system test, configuration, and debug.
  • RoHS Compliant — Device meets current RoHS environmental requirements.

Typical Applications

  • Industrial Control & Automation — Industrial-grade temperature rating and high I/O count enable robust control, sensor aggregation, and real-time logic in factory and process automation.
  • High-Density Digital Processing — Large logic element count and significant on-chip RAM make the device suitable for complex custom datapaths, protocol processing, and hardware acceleration tasks.
  • High-Speed Interfaces & Networking — Extensive I/O and family-level high-speed differential I/O support fit applications requiring numerous physical interfaces and precise clocking (PLLs & clock networks).
  • Embedded Memory Buffering — Approximately 7.4 Mbits of embedded RAM supports packet buffering, frame storage, and local scratchpad memory for throughput-centric designs.

Unique Advantages

  • High Integration Density: Large logic and memory resources reduce the need for external ASICs or multiple FPGAs, simplifying system BOM and board complexity.
  • Broad Connectivity: 773 I/Os and advanced I/O architecture allow designers to support many peripherals and high-pin-count interfaces from a single device.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C and industrial-grade classification support deployment in temperature-challenging environments.
  • Flexible Clocking: Family-level PLLs and clock networks enable precise clock domain management and high-performance synchronous designs.
  • Test and Configuration Tooling: Built-in JTAG and embedded logic analysis capabilities (referenced in family documentation) streamline development, in-system test, and debug.

Why Choose EP1S80F1020I7N?

The EP1S80F1020I7N combines substantial logic capacity, significant on-chip memory, and a high I/O count in a 1020-ball BGA package targeted at industrial applications. Its electrical and thermal ratings, together with the Stratix family’s documented clocking, memory, and I/O capabilities, make it a strong option for designers needing a scalable, highly connected programmable device for complex digital systems.

This device is well suited to engineering teams building high-density custom logic, embedded processing, or connectivity-rich systems that require robust temperature performance and ample on-chip resources. Backed by extensive Stratix family documentation, it supports disciplined development, testing, and deployment workflows.

Request a quote or submit an RFQ to receive pricing and lead-time information for EP1S80F1020I7N and to discuss how this device can fit into your next design.

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