EP1S80F1508C7

IC FPGA 1203 I/O 1508FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 1203 7427520 79040 1508-BBGA, FCBGA

Quantity 1,122 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O1203Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7904Number of Logic Elements/Cells79040
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7427520

Overview of EP1S80F1508C7 – Stratix® Field Programmable Gate Array (FPGA) IC 1203 7427520 79040 1508-BBGA, FCBGA

The EP1S80F1508C7 is a Stratix‑family Field Programmable Gate Array offering a high-density programmable fabric with 79,040 logic elements and approximately 7.43 Mbits of embedded memory. Designed for surface‑mount integration, the device comes in a 1508‑BBGA / 1508‑FBGA (40×40) package and exposes 1,203 I/O pins for complex system interfacing.

Documented in the Stratix device handbook, the device architecture includes advanced clocking and I/O capabilities, on‑chip DSP/multiplier and memory resources, and configuration and testing support—making it appropriate for demanding commercial applications that require programmable logic capacity, extensive I/O, and integrated memory.

Key Features

  • Logic Capacity  79,040 logic elements providing a large programmable fabric for complex logic and control functions.
  • Embedded Memory  Approximately 7.43 Mbits of on‑chip RAM to support packet buffering, LUT storage, and embedded data structures.
  • I/O Resources  1,203 general‑purpose I/O pins to support wide parallel interfaces and multi‑lane signaling requirements.
  • Package & Mounting  1508‑BBGA / 1508‑FBGA supplier package in a 40×40 format; surface‑mount device suitable for standard PCB assembly flows.
  • Power Supply  Core voltage range specified at 1.425 V to 1.575 V for precise supply planning and power budgeting.
  • Operating Conditions  Commercial temperature grade with operating range 0 °C to 85 °C for typical commercial‑environment deployments.
  • Configuration & Test Capabilities  Datasheet documentation highlights JTAG boundary‑scan, SignalTap II embedded logic analyzer and multiple configuration modes for development and in‑system validation.
  • Clocking & DSP Resources  Stratix device handbook details PLLs, clock networks and DSP/multiplier block interfaces for synchronous designs and signal processing tasks.
  • Standards Compliance  RoHS compliant, supporting environmental and manufacturing requirements for lead‑free assemblies.

Typical Applications

  • High‑performance digital systems  Leverage the large logic capacity and on‑chip memory for protocol processing, state machines, and custom compute accelerators.
  • Data buffering and interface bridging  Extensive I/O and embedded RAM enable wide parallel interfaces, bus bridging, and temporary data storage in multi‑channel systems.
  • Signal processing and DSP tasks  Documented DSP block interfaces and dedicated arithmetic resources support algorithm implementation and real‑time processing.
  • System prototyping and development  Rich configuration and test support (JTAG, embedded logic analyzer, partial reconfiguration) streamlines debug and iterative design cycles.

Unique Advantages

  • High logic density: 79,040 logic elements provide headroom for complex RTL implementations and multi‑function designs.
  • Significant on‑chip memory: Approximately 7.43 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O count: 1,203 I/Os enable broad connectivity for parallel buses, multi‑lane interfaces, and mixed I/O topologies.
  • Documented architecture and tools support: Stratix device handbook coverage of PLLs, clock networks, configuration modes and embedded test features supports predictable design integration and validation.
  • Commercial temperature and RoHS compliance: Clear specification of 0 °C to 85 °C operating range and RoHS status for commercial product lines.
  • Package options for dense PCBs: 1508‑BBGA / 1508‑FBGA (40×40) package supports compact board layouts and high‑pin‑count routing.

Why Choose EP1S80F1508C7?

The EP1S80F1508C7 provides a compelling combination of high logic count, substantial on‑chip memory, and a very large I/O footprint in a single Stratix FPGA device. Its documented clocking, DSP and configuration features make it suitable for commercial designs that require significant programmable logic capacity alongside integrated memory and advanced I/O capabilities.

This device is appropriate for engineering teams building complex, performance‑oriented systems who require predictable electrical specifications (1.425–1.575 V core), commercial temperature operation, and RoHS compliance. The Stratix handbook references included in the product documentation support detailed integration, timing, and validation workstreams.

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