EP1SGX10CF672C6

The EP1SGX10CF672C6 is a commercial-grade Stratix® GX FPGA from Intel (Altera) combining a high-performance logic array with the Stratix GX family’s high-speed serial transceiver architecture. This device provides 10,570 logic elements, a high I/O count, and substantial on-chip RAM, making it suitable for high-speed backplane interfaces, chip-to-chip links, and communications protocol-bridging tasks.

Designed for surface-mount applications, the device is supplied in a compact 672-BBGA package (supplier device package: 672-FBGA, 27×27) and is RoHS compliant. Key electrical and environmental boundaries include a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Programmable logic density — 10,570 logic elements provide flexible, user-configurable logic resources for implementing custom digital functions and protocol processing.
• Embedded memory — Approximately 0.92 Mbits of on-chip RAM (920,448 total RAM bits) for FIFOs, buffers, and packet or frame storage without external memory.
• High I/O count — 362 I/O pins support dense external interfacing for parallel buses, memory interfaces, and multiple high-speed I/O channels.
• Stratix GX transceiver capabilities (family-level) — The Stratix GX family incorporates high-speed serial transceiver technology with clock data recovery and SERDES support up to 3.1875 Gbps and compatibility with protocols such as PCI Express, Gigabit Ethernet, and Fibre Channel as described in the family datasheet.
• Package & mounting — Surface-mount 672-BBGA package (supplier device package 672-FBGA, 27×27) for compact board-level integration.
• Power and environmental — Core supply 1.425 V–1.575 V; commercial operating temperature range 0 °C–85 °C; RoHS compliant.

Typical Applications

• High-speed backplane interfaces — Use the device’s logic density and family transceiver architecture to implement backplane protocols and high-throughput data switching.
• Chip-to-chip communication — Leverage the Stratix GX family’s SERDES and CDR support for robust chip-to-chip serial links in multi-FPGA or ASIC–FPGA systems.
• Protocol bridging and packet processing — Implement protocol conversion, packet buffering, and custom packet-processing pipelines using on-chip RAM and programmable logic.

Unique Advantages

• Balanced logic and memory — 10,570 logic elements combined with approximately 0.92 Mbits of embedded RAM allow mixed compute-and-buffer functions without immediate need for external memory.
• High I/O capacity — 362 I/O pins enable integration with wide parallel buses, multiple peripherals, and external memory interfaces.
• Family-level high-speed serial support — Stratix GX transceiver features documented in the family datasheet (SERDES, CDR, and protocol support) provide the building blocks for high-bandwidth serial links.
• Compact board footprint — 672-BBGA / 672-FBGA (27×27) packaging supports dense PCB layouts while maintaining high pin count.
• Commercial-grade availability — Designed for commercial electronics with specified operating temperature and RoHS compliance for standard industrial and communications applications.

Why Choose EP1SGX10CF672C6?

The EP1SGX10CF672C6 delivers a pragmatic combination of programmable logic capacity, embedded memory, and high I/O resources in a compact BGA package. Backed by the Stratix GX family’s high-speed serial transceiver architecture (as documented in the family datasheet), this device is well suited for designs that require programmable protocol handling, high-throughput data paths, and flexible interfacing.

Its commercial-grade specification, RoHS compliance, and clearly defined supply and thermal boundaries make it a reliable choice for communications, networking, and high-speed digital systems where on-chip memory and a high pin count are important design drivers.

Request a quote or submit an inquiry for pricing and availability to move your design forward with EP1SGX10CF672C6.