EP1SGX10CF672C7N

The EP1SGX10CF672C7N is an Intel Stratix® GX family FPGA presented in a 672-ball BGA package. It combines a scalable, high-performance logic array with the Stratix GX family transceiver technology to address high-speed communications, backplane, and chip-to-chip bridging applications.

This commercial-grade, surface-mount device pairs 10,570 logic elements and approximately 0.92 Mbits of embedded RAM with a high I/O count and a low-voltage supply range, providing a balanced platform for designs that require logic density, embedded memory, and advanced serial interface capability.

Key Features

• Logic Fabric  10,570 logic elements for implementing complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 0.92 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic without reducing logic resources.
• High-Speed Transceiver Technology  Stratix GX family transceiver features include clock data recovery (CDR), embedded SERDES, programmable pre-emphasis and equalization, and support for full-duplex serial operation up to multi-gigabit rates as described in the Stratix GX family documentation.
• I/O Density  362 user I/Os provide ample interface capability for parallel buses, differential pairs, and mixed I/O signaling in complex systems.
• DSP and Clocking Resources  High-speed DSP blocks and multiple PLLs in the Stratix GX family support multiply-accumulate functions and advanced clock management (family-level features).
• Power and Supply  Designed for a core voltage supply of 1.425 V to 1.575 V to meet system power requirements.
• Package and Mounting  672-ball BGA (672-FBGA, 27×27) surface-mount package for high-density board integration.
• Operating Range  Commercial temperature rating with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Speed Communications Equipment  Implements protocol bridging, data aggregation, and SERDES-based links using the Stratix GX transceiver feature set.
• Backplane and Chip-to-Chip Interfaces  Supports high-density parallel and serial interfaces for backplane routing and board-to-board links where I/O count and signal integrity are critical.
• Network and Telecom Systems  Used for packet processing, frame alignment, and protocol adaptation leveraging on-chip memory and DSP resources.
• Custom Accelerator and Signal Processing  Deploy DSP blocks and embedded RAM for specialized compute tasks such as filtering and MAC operations.

Unique Advantages

• Substantial Logic Capacity:  10,570 logic elements enable implementation of sizable custom logic and state machines without external logic expansion.
• On-Chip Memory:  Approximately 0.92 Mbits of embedded RAM reduces the need for external buffering and improves throughput for streaming and packetized data flows.
• High I/O Count:  362 I/Os deliver flexible connectivity for mixed-signal interfaces, wide parallel buses, and differential signaling requirements.
• Integrated High-Speed Serial Features:  Stratix GX family transceiver capabilities (CDR, SERDES, programmable equalization) help simplify high-speed link design and signal integrity tuning.
• Compact, High-Density Package:  672-BBGA (27×27) packaging supports high pin counts in a space-efficient footprint for dense board designs.
• Design and Configuration Support:  Stratix GX family devices are supported by Intel design flows (family datasheet references Quartus® II software for transceiver power management and configuration features).

Why Choose EP1SGX10CF672C7N?

The EP1SGX10CF672C7N offers a balanced combination of logic density, embedded memory, and high I/O capability in a commercial-grade Stratix GX FPGA package. Its family-level transceiver features and DSP resources make it well suited for designers implementing high-speed communications, protocol bridging, and compute-accelerated functions where integration and signal integrity matter.

With RoHS compliance, a compact 672-ball BGA footprint, and support from the Stratix GX design ecosystem, this device provides a scalable platform for mid-range FPGA applications requiring on-chip memory and advanced serial interface capabilities.

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