EP1SGX10DF672C5N

The EP1SGX10DF672C5N is a Stratix® GX family FPGA in a 672-BBGA (27×27) surface-mount package, optimized for designs that require a high degree of on-chip logic, I/O density, and embedded memory. This commercial-grade device provides 10,570 logic elements, approximately 0.92 Mbits of embedded RAM, and 362 user I/O pins, making it suitable for complex digital systems and advanced interface tasks.

Built on the Stratix GX architecture, the family includes high-speed serial transceiver technology and a 1.5-V logic array; these family-level capabilities support high-performance communications, backplane interfaces, and protocol-bridging applications where integrated logic, memory, and I/O density accelerate time to market.

Key Features

• Logic Capacity  10,570 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Total on-chip RAM of 920,448 bits (approximately 0.92 Mbits) for FIFOs, buffers, and data storage without reducing logic resources.
• I/O Density  362 user I/O pins provide extensive interface flexibility for parallel buses, external memory, and multi-channel connectivity.
• Power and Voltage  Designed for a core supply range of 1.425 V to 1.575 V consistent with 1.5-V Stratix logic operation.
• Package and Mounting  672-FBGA (27×27) package in a surface-mount form factor for dense board integration and reliable signal routing.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
• RoHS Compliant  Manufactured to meet RoHS environmental standards.
• Stratix GX Family Transceiver Features (Series Level)  The Stratix GX family includes high-speed serial transceivers with CDR supporting 500 Mbps to 3.1875 Gbps, programmable VOD, pre-emphasis and equalization, and protocol support for interfaces such as XAUI and GigE.
• Scalable FPGA Architecture (Series Level)  Family features include TriMatrix memory blocks, dedicated DSP resources, multiple PLLs, and support for a range of high-speed external memory interfaces.

Typical Applications

• High-speed backplane interfaces  Use the device’s logic capacity and Stratix GX family transceiver capabilities for protocol bridging and board-to-board communications on high-speed backplanes.
• Communications equipment  Deploy in networking and communications gear that requires embedded memory, abundant I/O, and series-level serial transceiver support for Ethernet and SONET/SDH class links.
• Chip-to-chip bridging  Implement protocol translation and data aggregation between ASICs, processors, and external memory with the FPGA’s logic resources and extensive I/O.
• Interface and protocol conversion  Leverage on-chip RAM and logic to implement packet buffering, word alignment, and protocol adaptation functions.

Unique Advantages

• Substantial on-chip logic and memory: 10,570 logic elements combined with approximately 0.92 Mbits of RAM reduce reliance on external components and simplify board design.
• High I/O count for system integration: 362 I/O pins enable dense interfacing to memories, peripherals, and multi-lane buses without extensive signal multiplexing.
• Compact, assembly-friendly package: 672-FBGA (27×27) surface-mount package provides a space-efficient footprint while supporting complex routing requirements.
• Commercial temperature and RoHS compliance: Clear operating range of 0 °C to 85 °C and RoHS-compliant manufacturing for standard commercial deployments.
• Stratix GX family capabilities: Access to high-speed serial transceiver features and scalable architecture elements (DSP blocks, PLLs, TriMatrix memory) for demanding interface and signal-processing tasks.

Why Choose EP1SGX10DF672C5N?

The EP1SGX10DF672C5N positions itself as a versatile Stratix GX FPGA option for engineers who need a balance of logic capacity, embedded memory, and high I/O density in a compact BGA package. Its specification set supports applications that require integrated buffering, protocol adaptation, and dense external connectivity while remaining within commercial-temperature operating profiles.

Choosing this device provides designers with Stratix GX family-level transceiver and architecture advantages combined with explicit device-level resources—making it a practical choice for networking, communications, and high-performance interface designs that require proven FPGA building blocks and a clear supply-voltage and temperature specification.

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