EP1SGX10DF672C7N

IC FPGA 362 I/O 672FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 362 920448 10570 672-BBGA

Quantity 971 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O362Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1057Number of Logic Elements/Cells10570
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits920448

Overview of EP1SGX10DF672C7N – Stratix® GX Field Programmable Gate Array (FPGA) IC 362 920448 10570 672-BBGA

The EP1SGX10DF672C7N is a Stratix® GX family FPGA in a 672-ball FineLine BGA package targeted at commercial electronic designs. It combines a high-performance 1.5‑V logic array architecture with on-chip embedded memory and extensive I/O to address high-speed backplane, chip-to-chip, and communications protocol-bridging applications.

Key device-level specifications include 10,570 logic elements, approximately 0.92 Mbits of embedded RAM, 362 I/O pins, a 672‑BBGA surface-mount package (27×27 mm FBGA supplier footprint), a nominal core supply range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Array  The device provides 10,570 logic elements suitable for scalable digital designs and protocol implementation.
  • Embedded Memory  Approximately 0.92 Mbits of on-chip RAM for FIFOs, buffers, and packet storage.
  • High-Speed Serial Transceiver Technology (family-level)  Stratix GX family transceivers include clock data recovery (CDR) and embedded SERDES supporting data rates up to 3.1875 Gbps and common high-speed serial protocols.
  • Broad I/O Capability  362 I/O pins with support for multiple single-ended and differential I/O standards as provided by the Stratix GX architecture.
  • DSP and Clocking Resources  Family features include dedicated DSP blocks and multiple PLLs for clock multiplication, phase shifting, and real-time reconfiguration to support high-performance signal processing and timing control.
  • Package & Mounting  672-BBGA (supplier package: 672-FBGA, 27×27 mm) in a surface-mount footprint suitable for compact board layouts.
  • Power & Voltage  Core supply specified from 1.425 V to 1.575 V, matching the Stratix GX 1.5‑V logic array operating range.
  • Commercial Grade & RoHS  Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant construction for standard commercial applications.

Typical Applications

  • High‑speed backplane interfaces  Use the Stratix GX family’s high-speed serial capabilities and dense logic fabric to implement backplane switching, aggregation, and protocol translation functions.
  • Chip‑to‑chip interconnect  Implement custom SERDES-based links and interface logic for board‑level or module-to-module high-speed data transfer.
  • Communications protocol bridging  Map between serial protocols and parallel logic or perform format conversion leveraging abundant logic elements and embedded RAM.
  • Network and telecom equipment  Deploy in commercial network equipment that requires programmable protocol adaptation and packet buffering within the stated temperature and supply ranges.

Unique Advantages

  • Scalable programmable logic: 10,570 logic elements enable implementation of complex state machines, protocol stacks, and custom datapaths without external ASIC development.
  • On-chip embedded memory: Approximately 0.92 Mbits of RAM supports FIFOs, packet buffering, and temporary storage, reducing the need for external memory in many designs.
  • Family-level high-speed serial support: Stratix GX series transceivers (with CDR and SERDES) support up to 3.1875 Gbps data rates and common communications standards, simplifying high-speed link implementation.
  • Flexible I/O and clocking: Extensive I/O count and the family’s PLL/DSP resources provide design flexibility for mixed-signal interfaces and high-performance timing architectures.
  • Compact package: 672‑BBGA (27×27 mm) surface-mount package provides a high pin-count, compact footprint for space-constrained boards.
  • Commercial readiness: Commercial temperature rating and RoHS compliance make the device appropriate for standard commercial electronic products and assemblies.

Why Choose EP1SGX10DF672C7N?

The EP1SGX10DF672C7N delivers a balanced combination of programmable logic density, embedded memory, and Stratix GX family high-speed serial capabilities in a compact 672‑BBGA package. It is well suited to commercial designs that require protocol bridging, high-speed links, and on-device buffering while operating within a 0 °C to 85 °C range and a 1.425 V–1.575 V core supply.

As part of the Stratix GX family, this FPGA offers architecture and transceiver features intended for communication-focused and high-throughput applications, providing a path for scalable implementations and integration within existing design flows.

Request a quote or submit a procurement inquiry to check availability and lead times for EP1SGX10DF672C7N.

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