EP1SGX10DF672I6

The EP1SGX10DF672I6 is a Stratix® GX field-programmable gate array (FPGA) from Intel that combines a scalable high-performance logic array with the Stratix GX family’s high-speed serial transceiver technology. With 10,570 logic elements, approximately 0.92 Mbits of embedded RAM, and 362 I/O pins in a 672-ball BGA, this device targets high-speed communications, backplane, and protocol-bridging applications that require dense logic, substantial on-chip memory, and robust I/O capability.

Key Features

• Core Logic  10,570 logic elements provide programmable density for complex control, packet processing, and glue-logic tasks.
• Embedded Memory  Approximately 0.92 Mbits (920,448 bits) of on-chip RAM for FIFOs, buffers, and packet buffering.
• High-Speed Transceivers (Stratix GX family)  Series-level transceiver features include clock data recovery (CDR), embedded SERDES, and full-duplex operation from 500 Mbps to 3.1875 Gbps, with protocol support such as XAUI, Gigabit Ethernet, and SONET/SDH.
• Flexible I/O and Interfaces  362 I/O pins and support for numerous single-ended and differential I/O standards; programmable transceiver-to-FPGA interface widths and support for LVDS/LVPECL/PCML reference clocks (series-level).
• DSP and Clocking Resources  High-speed DSP blocks and multiple PLLs are available in the Stratix GX family for multiply-accumulate and real-time clocking functions (series-level capabilities referenced in the datasheet).
• Power and Voltage  Supported supply voltage range: 1.425 V to 1.575 V.
• Package and Temperature  672-ball BGA package (supplier device package: 672-FBGA, 27×27) and industrial-grade operating range of −40 °C to 100 °C.
• Reliability and Test  Series-level features include built-in self test (BIST), hot insertion/removal protection circuitry, pattern detection, word alignment, and an 8B/10B encoder/decoder for link-level diagnostics and integrity.
• Compliance  RoHS compliant.

Typical Applications

• High-speed backplane interfaces  Use the device’s dense logic, abundant I/O, and Stratix GX transceiver features to implement protocol bridging and packet switching on backplanes.
• Chip-to-chip and board-to-board links  Implement SERDES-based links and source-synchronous interfaces for reliable high-speed data transfer between components.
• Communications protocol bridging  Leverage on-chip memory and transceiver encoding/decoding features to bridge and translate between Ethernet, SONET/SDH, and other serial protocols.
• High-performance packet buffering and processing  Deploy the embedded RAM and DSP resources for packet buffering, classify-and-forward logic, and real-time signal processing.

Unique Advantages

• Balanced logic and memory capacity: 10,570 logic elements paired with approximately 0.92 Mbits of embedded RAM support medium-complexity designs with significant buffering needs.
• High I/O count for system integration: 362 I/Os enable wide data buses, parallel interfaces, and extensive peripheral connectivity without external multiplexing.
• Stratix GX transceiver feature set: Series-level transceiver capabilities—CDR, SERDES, programmable VOD/pre-emphasis/equalization, and protocol support—help implement robust serial links and simplify signal-integrity tuning.
• Industrial temperature range: Rated for −40 °C to 100 °C for deployment in industrial environments where extended temperature operation is required.
• Compact BGA package: 672-ball BGA (27×27) allows a high-density implementation while maintaining board-level routing efficiency.
• Design and test features: Built-in self test, pattern detection, 8B/10B encoding/decoding, and hot-swap protection capabilities from the Stratix GX family improve diagnostics and uptime.

Why Choose EP1SGX10DF672I6?

The EP1SGX10DF672I6 offers a practical combination of programmable logic, embedded memory, and extensive I/O in a single industrial-grade 672-BGA package. Built on the Stratix GX architecture, the device brings series-level high-speed transceiver functionality together with a sizeable logic and RAM resource set appropriate for communications, protocol bridging, and high-bandwidth system designs.

Its voltage and thermal ratings, RoHS compliance, and the Stratix GX family’s on-chip test and transceiver features make it well suited for engineers needing a robust, mid-density FPGA platform for deployment in industrial and communications equipment.

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