EP1SGX25CF672C6N
| Part Description |
Stratix® GX Field Programmable Gate Array (FPGA) IC 455 1944576 25660 672-BBGA |
|---|---|
| Quantity | 1,561 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 455 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1SGX25CF672C6N – Stratix GX FPGA, 672‑BBGA, 455 I/O
The EP1SGX25CF672C6N is an Intel Stratix® GX field programmable gate array (FPGA) in a 672‑ball BGA package designed for commercial applications. Built on the Stratix GX architecture and a 1.5‑V logic array, it combines substantial logic capacity and embedded memory with a high I/O count for demanding digital designs.
This device is well suited for high‑performance communications and system‑level applications that require dense logic, significant on‑chip RAM, and a large number of I/O signals while operating within a commercial temperature range.
Key Features
- Logic Capacity — 25,660 logic elements (LEs) to implement complex logic, state machines, and system functions.
- Embedded Memory — Approximately 1.94 Mbits of on‑chip RAM (1,944,576 total RAM bits) for buffers, FIFOs, and local data storage.
- I/O Resources — 455 user I/O pins to support wide parallel interfaces and multiple external connections.
- Power and Core Voltage — Operates from a device supply range of 1.425 V to 1.575 V, compatible with the Stratix 1.5‑V logic array architecture.
- Package and Mounting — 672‑BBGA package (supplier package listed as 672‑FBGA, 27 × 27) for surface‑mount PCB assembly and compact system layouts.
- Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards and Compliance — RoHS compliant for environmental conformity.
- Stratix GX Family Capabilities — Built on a family architecture that includes high‑speed serial transceiver support, TriMatrix memory architecture, dedicated DSP blocks, and multiple PLLs and clock networks (family features documented in the Stratix GX datasheet).
Typical Applications
- Communications and Networking — Implements protocol bridging, packet processing, and backplane interfacing where dense logic and substantial on‑chip RAM are required.
- High‑Speed Data Paths — Supports system designs that need wide parallel data buses or many external interfaces using the device’s 455 I/Os.
- Signal Processing and DSP Functions — Leverages extensive logic elements and embedded memory for custom DSP pipelines, buffering, and multiply‑accumulate operations.
- Prototyping and System Integration — Suitable for system prototypes and commercial devices that benefit from FPGA reprogrammability and a compact BGA package.
Unique Advantages
- High Logic Density: 25,660 logic elements enable implementation of complex control, processing, and interfacing functions on a single device.
- Significant On‑Chip Memory: Approximately 1.94 Mbits of embedded RAM reduces external memory needs for many buffering and packet‑storage tasks.
- Large I/O Count: 455 I/Os provide flexibility to connect multiple peripherals, buses, or parallel interfaces without additional I/O expanders.
- Compact BGA Packaging: 672‑ball FBGA package (27 × 27) minimizes PCB footprint while supporting high‑density routing for production systems.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, making it appropriate for a broad range of commercial electronic products.
- RoHS Compliant: Conforms to lead‑free and hazardous substance restrictions for global manufacturing requirements.
Why Choose EP1SGX25CF672C6N?
The EP1SGX25CF672C6N positions itself as a capable Stratix GX‑based solution for designers who need a balance of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its specified supply range and commercial temperature rating make it suitable for a wide variety of commercial system designs that require reprogrammability and in‑field flexibility.
Engineers building communication subsystems, data‑path controllers, or integration platforms will find the combination of approximately 25.7k logic elements, nearly 1.94 Mbits of RAM, and 455 I/Os useful for consolidating functions, reducing board complexity, and shortening development cycles—backed by the Stratix GX family architecture documented in the device datasheet.
Request a quote or submit an inquiry for pricing and availability of the EP1SGX25CF672C6N to evaluate fit for your next commercial FPGA design.

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