EP1SGX25CF672I6N

IC FPGA 455 I/O 672FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 455 1944576 25660 672-BBGA

Quantity 314 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O455Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1SGX25CF672I6N – Stratix® GX FPGA, 455 I/O, ~1.94 Mbits RAM, 25,660 logic elements

The EP1SGX25CF672I6N is a Stratix GX field-programmable gate array (FPGA) in a 672-BBGA surface-mount package, designed for high-density logic and I/O applications. Built on the Stratix GX family architecture, it targets designs that require substantial logic capacity, large embedded memory, and robust I/O counts for high-performance communications and system integration.

With 25,660 logic elements, approximately 1.94 Mbits of embedded RAM, and 455 user I/Os, this industrial-grade device supports demanding embedded and communications roles while operating over a wide voltage and temperature range.

Key Features

  • Logic Capacity  25,660 logic elements provide substantial programmable fabric for implementing complex control, signal processing, and protocol logic.
  • Embedded Memory  Total on-chip RAM of 1,944,576 bits (approximately 1.94 Mbits) for FIFOs, buffers, and on-chip data storage.
  • I/O and Packaging  455 user I/Os in a 672-BBGA (supplier package: 672-FBGA, 27 × 27 mm) surface-mount package, enabling high-density board-level connectivity.
  • Power and Thermal  Core supply range 1.425 V to 1.575 V and industrial operating temperature from −40 °C to 100 °C support deployment in temperature-challenging environments.
  • Stratix GX Family Transceiver Capabilities  As part of the Stratix GX family, devices in this family support high-speed serial transceivers with embedded CDR and SERDES at data rates up to 3.1875 Gbps and common communications protocol support (family-level feature).
  • System and Design Support (Family)  Stratix GX family features include dedicated DSP blocks, multiple PLLs, and extensive clock-network resources to support high-performance signal processing and timing architectures (family-level feature).
  • Compliance  RoHS-compliant and manufactured to industrial-grade specifications.

Typical Applications

  • High-speed communications interfaces  Family transceiver capabilities and large logic/memory resources make the device suitable for protocol bridging and serial link implementations.
  • Backplane and chip-to-chip interconnect  High I/O count and Stratix GX family transceiver performance support dense backplane and board-to-board data paths.
  • Industrial control and automation  Industrial temperature rating and robust power range allow deployment in factory-floor and industrial embedded systems.
  • High-density embedded systems  Large logic element count and embedded RAM enable complex control, signal processing, and buffering tasks within compact system designs.

Unique Advantages

  • High logic integration: 25,660 logic elements let you consolidate multiple functions into a single FPGA, reducing board-level component count.
  • Substantial embedded memory: Approximately 1.94 Mbits of on-chip RAM supports deep buffering and low-latency data paths without external memory.
  • Extensive I/O connectivity: 455 user I/Os in a 672-BBGA package enable complex, high-density interfacing to peripherals and backplanes.
  • Industrial robustness: Operates from −40 °C to 100 °C and is RoHS-compliant, matching industrial deployment requirements.
  • Family-level high-speed serial support: Stratix GX family transceiver technology provides up to 3.1875 Gbps serial links and protocol support useful for communications designs.

Why Choose EP1SGX25CF672I6N?

The EP1SGX25CF672I6N combines a large logic fabric, significant embedded memory, and a high I/O count in an industrial-grade Stratix GX device, making it well suited for complex communications, high-density embedded systems, and industrial control applications. Its operating voltage and temperature ranges, together with family-level high-speed transceiver capabilities, provide a solid platform for designs that require both performance and environmental robustness.

For teams building systems that need scalable logic resources, on-chip RAM, and dense connectivity, this Stratix GX device offers a balanced mix of integration and deployability backed by the Stratix GX family feature set.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the EP1SGX25CF672I6N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up