EP1SGX25CF672C7

The EP1SGX25CF672C7 is a Stratix GX family FPGA in a 672-ball FineLine BGA (27×27 mm) package designed for high-density programmable logic and system integration. It combines 25,660 logic elements, approximately 1.94 Mbits of embedded memory, and 455 user I/Os to address demanding communications, backplane, and chip-to-chip interface applications.

As a member of the Stratix GX family, the device benefits from the series' high-speed serial transceiver technology and scalable Stratix architecture to deliver a balance of logic capacity, embedded memory, and I/O bandwidth for commercial-grade designs.

Key Features

• Logic Capacity — 25,660 logic elements for implementing substantial custom logic, protocol handling, and compute pipelines.
• Embedded Memory — Approximately 1.94 Mbits of on-chip RAM to support large buffering, FIFOs, and local storage without external memory for many use cases.
• I/O Density — 455 user I/O pins to support wide parallel interfaces, multiple high-speed channels, and extensive board-level connectivity.
• Transceiver Family Capabilities — Stratix GX family transceiver features include full-duplex operation from 500 Mbps to 3.1875 Gbps per channel, programmable pre-emphasis and equalization, and protocol support for GigE, XAUI, SONET/SDH and others (family-level features).
• Power and Supply — Core voltage supply specified between 1.425 V and 1.575 V to match system power rails and design constraints.
• Package & Mounting — 672-FBGA (27×27 mm) FineLine BGA package, surface-mount mounting for compact PCB implementation.
• Operating Grade — Commercial-grade device specified for 0 °C to 85 °C operating temperature range.
• Compliance — RoHS-compliant device to support lead-free manufacturing requirements.

Typical Applications

• High-speed backplane interfaces — Use the device's dense I/O and family transceiver features to implement multi-lane backplane protocols and bridging functions.
• Chip-to-chip communications — Leverage programmable logic and transceiver capabilities for custom SERDES links and protocol conversion between ICs.
• Network and protocol bridging — Implement protocol termination, packet buffering, and format conversion using abundant logic elements and embedded RAM.

Unique Advantages

• High logic density: 25,660 logic elements enable complex state machines, packet engines, and signal processing in a single device.
• Substantial embedded memory: Approximately 1.94 Mbits of on-chip RAM reduces reliance on external memory for many buffering and queuing tasks.
• Broad I/O resources: 455 user I/Os provide flexibility for parallel interfaces, control signals, and multiple high-speed lanes without sacrificing routing margin.
• Family transceiver pedigree: Stratix GX transceiver capabilities (500 Mbps–3.1875 Gbps per channel) enable implementation of common serial protocols and high-bandwidth links (family-level feature set).
• Industry-friendly package: 672-ball FineLine BGA (27×27 mm) supports high pin-count designs while minimizing PCB footprint.
• Manufacturing readiness: Surface-mount package and RoHS compliance support modern assembly flows and environmental requirements.

Why Choose EP1SGX25CF672C7?

The EP1SGX25CF672C7 delivers a balanced combination of logic capacity, embedded memory, and I/O count in a compact 672-BBGA package, making it suitable for commercial designs that require significant on-chip resources and flexible I/O. As part of the Stratix GX family, it benefits from a proven architecture and transceiver feature set that address high-speed interface and protocol-bridging use cases.

Choose this device when your design requires high integration of logic, memory, and I/O in a single FPGA with commercial temperature range and RoHS compliance; it is well-suited to engineering teams building communications, backplane, or chip-to-chip interface systems that value on-chip resources and package density.

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