EP1SGX25CF672C7N

The EP1SGX25CF672C7N is a Stratix® GX field‑programmable gate array featuring a high‑performance 1.5‑V logic array and integrated high‑speed serial transceiver capability. With 25,660 logic elements and approximately 1.94 Mbits of embedded RAM, this commercial‑grade, surface‑mount FPGA is targeted at high‑speed backplane, chip‑to‑chip and communications protocol‑bridging applications that require dense logic, abundant I/O and multi‑Gbps serial connectivity.

Key Features

• Core Logic: 25,660 logic elements provide substantial programmable logic capacity for complex designs and system integration.
• Embedded Memory: Approximately 1.94 Mbits of on‑chip RAM for buffering, FIFOs and packet processing.
• High‑Speed Serial Transceivers: Family transceiver technology supports 500 Mbps to 3.1875 Gbps per channel with clock‑data recovery (CDR), embedded SERDES and protocol features such as 8B/10B encoding/decoding and pattern detection.
• Transceiver Bandwidth: Devices in the family are available with multiple transceiver counts (4–20 channels), delivering up to 127.5 Gbps of full‑duplex serial bandwidth at the device level.
• I/O Capability: 455 user I/O pins supporting a range of single‑ended and differential interfaces suitable for high‑speed source‑synchronous links and external memory interfaces.
• Power and Voltage: 1.5‑V logic architecture with specified supply range of 1.425 V to 1.575 V for core operation.
• Package & Mounting: 672‑BBGA package (supplier package: 672‑FBGA, 27×27) with surface‑mount mounting suitable for dense board layouts.
• Operating Conditions & Compliance: Commercial grade operation from 0 °C to 85 °C and RoHS compliant.
• Signal Integrity Controls: Programmable transmitter features (VOD, pre‑emphasis, equalization) and per‑channel power‑down capability to optimize board‑level signal integrity and power use.

Typical Applications

• High‑Speed Backplane Interfaces: Implement multi‑Gbps backplane links and protocol bridging where aggregated serial bandwidth and dense I/O are required.
• Chip‑to‑Chip Connectivity: Use embedded SERDES and source‑synchronous I/O for board‑level and board‑to‑board high‑speed links.
• Communications Protocol Bridging: Deploy transceiver features and on‑chip memory for protocol adaptation and packet buffering in network equipment.
• 10 Gigabit and Gigabit Networking: Support transceiver‑based protocols such as XAUI and GigE for line‑rate Ethernet applications.

Unique Advantages

• High Logic Density: 25,660 logic elements allow consolidation of multiple functions and reduce external glue logic.
• Integrated Multi‑Gbps Serial I/O: Built‑in transceivers with CDR and SERDES reduce the need for discrete serializers/deserializers and simplify high‑speed link design.
• Substantial On‑Chip Memory: Approximately 1.94 Mbits of RAM supports buffering and FIFO implementations without external memory for many use cases.
• Flexible Signal Conditioning: Programmable VOD, pre‑emphasis and equalization settings help meet board‑level signal integrity requirements.
• Dense I/O in a Compact Package: 455 I/O pins in a 672‑BBGA (27×27) package enable feature‑rich designs in space‑constrained PCBs.
• Design Scalability: Scalable Stratix GX architecture supports a range of transceiver counts and logic capacities across the family for easy migration.

Why Choose EP1SGX25CF672C7N?

The EP1SGX25CF672C7N combines a high‑density logic array with family‑level multi‑Gbps transceiver technology and significant embedded memory, making it well suited for networking, protocol bridging and high‑speed interface applications that demand integrated serial bandwidth and extensive I/O. Its 672‑BBGA package and commercial temperature grading support compact system designs and board‑level deployment.

For projects that need a balance of programmable logic, embedded RAM and integrated serial links, this Stratix GX device provides a scalable option within the family to consolidate functions, reduce board complexity and accelerate time‑to‑market.

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