EP1SGX25DF1020C6N

IC FPGA 607 I/O 1020FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 607 1944576 25660 1020-BBGA

Quantity 1,114 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O607Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1SGX25DF1020C6N – Stratix® GX Field Programmable Gate Array (FPGA) IC 607 1944576 25660 1020-BBGA

The EP1SGX25DF1020C6N is a commercial-grade Stratix GX family FPGA in a 1020-BBGA package, offering a balance of high logic capacity, on-chip memory, and a large I/O count for complex digital designs. It is a surface-mount device supplied with a core voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

As a member of the Stratix GX family, this device benefits from the family’s high-speed serial transceiver architecture and scalable logic array, making it suitable for high-speed backplane interfaces, chip-to-chip bridging, and communications protocol applications where integration and performance are required.

Key Features

  • Logic Capacity — 25,660 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 1.94 Mbits of on-chip RAM to support buffers, FIFOs, and packet processing without reducing logic resources.
  • High I/O Count — 607 I/O pins to support dense peripheral, memory, and high-speed interface connections.
  • Stratix GX Transceiver Family Features — Family-level transceiver capabilities include clock-data recovery (CDR) and embedded SERDES with data rates up to 3.1875 Gbps, support for common serial protocols, programmable pre-emphasis/equalization, and channel power-down features.
  • Advanced FPGA Architecture — Stratix GX family features such as TriMatrix memory organization, high-speed DSP blocks, and multiple PLLs are available within the family architecture to support high-performance signal processing and timing control.
  • Package & Mounting — 1020-BBGA package (supplier device package listed as 1020-FBGA, 33 × 33) and surface-mount mounting for space-efficient board designs.
  • Power & Thermal — Core voltage supply range of 1.425 V to 1.575 V with a commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑Speed Backplane Interfaces — Use the device’s family-level serial transceiver capabilities and high I/O count to implement backplane bridging and packet routing.
  • Chip‑to‑Chip Interconnect — Leverage embedded SERDES and programmable signal-conditioning features for reliable high-speed links between ICs.
  • Communications Protocol Bridging — Implement protocol conversion and protocol-aware packet processing using the FPGA’s logic capacity and on-chip RAM.
  • Signal Processing & DSP Acceleration — Use dedicated DSP resources and embedded memory for filtering, accumulation, and other real-time data-path functions.

Unique Advantages

  • Substantial Logic Resources: 25,660 logic elements enable implementation of complex custom logic, state machines, and protocol engines within a single device.
  • On-Chip Memory for Low-Latency Processing: Approximately 1.94 Mbits of embedded RAM reduce dependence on external memory for buffering and accelerate data-path operations.
  • High-Density I/O: 607 I/O pins accommodate multiple parallel buses, memory interfaces, and external peripherals without additional glue logic.
  • Family-Level High-Speed Serial Support: Stratix GX transceiver features (up to 3.1875 Gbps) and protocol support simplify integration of high-bandwidth serial links.
  • Compact System Integration: 1020-BBGA package and surface-mount mounting enable space-efficient PCB designs for densely populated boards.
  • Standards and Environmental Compliance: RoHS compliance aligns with common environmental requirements for commercial electronic products.

Why Choose EP1SGX25DF1020C6N?

The EP1SGX25DF1020C6N delivers a balanced combination of logic density, embedded memory, and extensive I/O in a Stratix GX FPGA package. It is positioned for designers who need scalable FPGA resources alongside the family’s high-speed serial capabilities to implement demanding communications, interfacing, and signal-processing functions.

Choose this device for commercial applications that require integrated on-chip RAM, a high I/O count, and access to the Stratix GX family feature set—providing a pathway to scalable performance within a single, RoHS-compliant FPGA solution.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP1SGX25DF1020C6N.

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