EP1SGX25DF1020C7

The EP1SGX25DF1020C7 is a Stratix® GX Field Programmable Gate Array (FPGA) IC from Altera. It integrates a large logic fabric, embedded RAM, and a high pin-count I/O footprint in a 1020-ball FCBGA package.

Key on-chip resources include 25,660 logic elements, approximately 1.94 Mbits of embedded memory, and 607 I/O pins, with a core supply range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  25,660 logic elements provide the primary programmable fabric for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 1.94 Mbits of on-chip RAM available for buffering, lookup tables, and local storage needs.
• I/O Density  607 user I/O pins support wide external connectivity and parallel interfaces.
• Package  1020-ball BGA (FCBGA) in a 33 × 33 mm supplier device package for compact, high-density board integration.
• Power  Core voltage supply range from 1.425 V to 1.575 V to match platform power rails and regulator designs.
• Operating Range  Commercial temperature grade rated for 0 °C to 85 °C operation.
• Mounting & Compliance  Surface-mount package construction and RoHS-compliant material status.

Typical Applications

• Custom Digital Processing  Implementation of user-defined digital logic, data-paths, and state machines using the device's large logic element count and embedded memory.
• High-Density I/O Systems  Systems requiring many parallel or high-pin-count interfaces can leverage the 607 available I/Os for external connectivity.
• Compact Board Designs  Use in space-constrained PCBs where a high-function FPGA is required in a 1020-ball FCBGA package.

Unique Advantages

• Substantial Logic Capacity:  25,660 logic elements enable significant on-chip logic implementation without additional discrete logic chips.
• On-Chip Memory:  Approximately 1.94 Mbits of embedded RAM reduces the need for external memory for many buffering and LUT requirements.
• Extensive External Connectivity:  607 I/O pins support broad interfacing options for sensors, peripherals, and parallel buses.
• Compact FCBGA Package:  1020-ball, 33 × 33 mm FBGA package offers a compact footprint for high-density PCB layouts.
• Controlled Power Envelope:  Defined core supply range (1.425 V–1.575 V) supports predictable power rail design.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS-compliant materials for standard commercial designs.

Why Choose EP1SGX25DF1020C7?

The EP1SGX25DF1020C7 positions itself as a high-capacity Stratix® GX FPGA option where substantial on-chip logic, embedded RAM, and a large number of I/Os are required within a compact FCBGA footprint. Its specified supply range and commercial temperature rating make it suitable for mainstream electronic designs that demand dense integration and predictable electrical characteristics.

This device is appropriate for designers and engineering teams building complex digital systems that need significant programmable resources, substantial local RAM, and extensive external connectivity while maintaining a compact board-level solution backed by Altera's Stratix® GX family.

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