EP1SGX25DF672C7

The EP1SGX25DF672C7 is a Stratix® GX field programmable gate array (FPGA) in a 672-BBGA surface-mount package. It combines a high-performance 1.5-V logic array architecture with on-chip embedded memory and a large I/O complement to support complex digital designs.

Targeted at high-speed communications and system-interface applications, this device is suited for designs that require substantial logic capacity, embedded RAM, and high pin-count connectivity within a commercial temperature range.

Key Features

• Logic Capacity — 25,660 logic elements provide substantial programmable logic resources for complex state machines, protocol handling, and custom datapaths.
• Embedded Memory — Approximately 1.94 Mbits of on-chip RAM (1,944,576 total RAM bits) for FIFOs, buffers, and memory-mapped functions.
• I/O Density — 455 user I/O pins for wide parallel interfaces, external memory buses, and multiple high-speed I/O channels.
• High-Speed Serial Transceiver Support (family level) — Stratix GX family transceivers include CDR and SERDES functionality with full-duplex operation up to 3.1875 Gbps and support for common serial protocols and equalization features.
• Power Supply — Supported core voltage range 1.425 V to 1.575 V to match system power domains and regulator designs.
• Package & Mounting — 672-ball BGA (supplier package 672-FBGA, 27 × 27 mm) in a surface-mount form factor for board-level integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for use in standard commercial equipment.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-Speed Communications — Implement protocol bridging and serial link interfacing using Stratix GX family transceiver features and on-chip logic to handle framing, encoding, and alignment functions.
• Backplane and Board-Level Interfaces — Provide wide parallel or serialized I/O for backplane gateways, network cards, and data concentrators leveraging the device’s high I/O count and embedded memory.
• Chip-to-Chip Interfacing — Use for protocol adaption and serialization/deserialization tasks between ASICs, processors, and memory subsystems.
• Custom Logic and DSP Acceleration — Implement state machines, datapaths, and buffering for application-specific acceleration where significant logic elements and embedded RAM are required.

Unique Advantages

• Substantial Logic Resource: 25,660 logic elements allow implementation of large-scale custom logic without external glue logic.
• Significant On-Chip Memory: Approximately 1.94 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High Pin Count for Flexible I/O: 455 I/Os enable broad connectivity options for parallel buses, multiple interfaces, and mixed-signal board designs.
• Family-Level Transceiver Capability: Stratix GX transceiver features (CDR, SERDES, up to 3.1875 Gbps) support implementation of high-speed serial protocols where required by the design.
• Board-Level Packaging: 672-ball BGA in a 27 × 27 mm footprint supports dense board layouts and robust surface-mount assembly.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to fit standard commercial product lifecycles.

Why Choose EP1SGX25DF672C7?

The EP1SGX25DF672C7 places a large logic fabric, nearly 2 Mbits of embedded RAM, and extensive I/O in a single 672-BBGA device. It is positioned for system designers who need a programmable, high-density solution for communications, interface bridging, and custom acceleration within standard commercial temperature ranges.

Using the Stratix GX family’s high-speed transceiver technology alongside the device’s logic and memory resources provides a scalable platform for designs that require both parallel and serial connectivity, allowing for reduced board-level complexity and streamlined integration.

Request a quote or submit an inquiry to obtain pricing and availability for EP1SGX25DF672C7.