EP1SGX25FF1020C7

IC FPGA 607 I/O 1020FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 607 1944576 25660 1020-BBGA, FCBGA

Quantity 229 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O607Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1SGX25FF1020C7 – Stratix® GX FPGA (25,660 logic elements, 1020-FBGA)

The EP1SGX25FF1020C7 is a Stratix® GX Field Programmable Gate Array (FPGA) from Altera, delivered in a 1020-BBGA FCBGA surface-mount package. It combines a high count of programmable logic resources, substantial embedded memory, and a very high I/O count in a commercial-grade device aimed at complex digital designs.

Key Features

  • Core Logic 25,660 logic elements provide the programmable logic capacity for implementing complex combinational and sequential logic functions.
  • Embedded Memory Approximately 1.94 Mbits of on-chip RAM for buffering, lookup tables, and state storage within user logic.
  • I/O Density 607 user I/O pins to support high-pin-count interfaces and multiple parallel data channels.
  • Power Core supply voltage specified at 1.425 V to 1.575 V, enabling precise power budgeting for the FPGA core.
  • Package & Mounting 1020-BBGA (FCBGA) supplier package 1020-FBGA (33×33) in a surface-mount format for compact, high-density PCB implementation.
  • Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for conformity with common lead-free manufacturing requirements.

Unique Advantages

  • High logic integration: 25,660 logic elements allow large portions of a system’s digital processing to be consolidated onto a single FPGA, reducing external component count.
  • Substantial on-chip memory: Approximately 1.94 Mbits of embedded RAM supports internal buffering and state retention without immediate dependence on external memory.
  • Extensive I/O capability: 607 I/Os enable dense interfacing to peripherals, sensors, and parallel buses directly from the FPGA.
  • Compact high-pin-count package: The 1020-FBGA (33×33) package provides a balance of high pin density and compact footprint for space-constrained PCBs.
  • Clear design constraints: Specified core voltage range and commercial temperature rating make electrical and thermal design parameters straightforward to apply during system development.

Why Choose EP1SGX25FF1020C7?

The EP1SGX25FF1020C7 is positioned for designs that require a large pool of programmable logic, significant on-chip RAM, and a very high I/O count delivered in a 1020-FBGA surface-mount package. Its commercial temperature rating and defined core voltage range provide clear integration parameters for mainstream electronic products.

Choose this Stratix® GX FPGA when your application needs consolidated digital logic, embedded memory resources, and dense interfacing while maintaining a compact board footprint and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to check pricing, availability, and lead times for EP1SGX25FF1020C7.

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