EP1SGX40DF1020C6

IC FPGA 624 I/O 1020FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA

Quantity 992 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1SGX40DF1020C6 – Stratix® GX Field Programmable Gate Array (FPGA) IC 1020-BBGA

The EP1SGX40DF1020C6 is a Stratix® GX family FPGA from Intel, delivered in a 1020-BBGA (1020-FBGA, 33×33) package for surface-mount assembly. It combines a high-performance logic array with the Stratix GX family architecture that targets high-speed backplane interfaces, chip-to-chip links, and communications protocol-bridging applications.

This device provides a large logic capacity and substantial embedded memory alongside a high I/O count and commercial-grade operating range, offering a balanced platform for complex digital designs that require both logic density and high-speed serial capabilities as documented for the Stratix GX family.

Key Features

  • Logic Capacity — 41,250 logic elements available for implementing complex digital functions and custom architectures.
  • Embedded Memory — 3,423,744 bits of on-chip RAM (approximately 3.42 Mbits) for FIFOs, frame buffers, and local storage without reducing logic resources.
  • I/O and Package — 624 user I/O pins in a 1020-BBGA package (supplier package: 1020-FBGA, 33×33), optimized for dense board-level integration and surface-mount assembly.
  • Power and Supply — Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
  • Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
  • Stratix GX Transceiver Technology (Family-Level) — The Stratix GX family includes high-speed serial transceivers with clock-data recovery (CDR) and embedded SERDES supporting full-duplex operation from 500 Mbps up to 3.1875 Gbps, with programmable pre-emphasis, equalization, and per-channel power-down capability.
  • DSP and Clocking Resources — Family documentation describes high-speed DSP blocks for multiply and multiply-accumulate functions and multiple PLL resources (up to eight general-use PLLs per device family) to support timing, spread-spectrum, and clock-multiplication needs.
  • Compliance and Environment — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • High‑Speed Networking Equipment — Implement backplane interfaces and protocol bridging where large logic arrays and high I/O count support packet processing and interface conversion.
  • Chip‑to‑Chip and Board‑to‑Board Links — Use the Stratix GX family’s serial transceiver features for reliable high-speed serial communications between devices and modules.
  • Communications Protocol Processing — Deploy for protocol adaptation and hardware-accelerated data handling in systems supporting Gigabit Ethernet, XAUI, SONET/SDH, and similar protocols (as documented for the Stratix GX family).
  • High‑Performance DSP and Signal Processing — Leverage on-chip RAM and dedicated DSP resources for finite impulse response (FIR) filters, MAC operations, and real-time data processing.

Unique Advantages

  • Large Logic Footprint: 41,250 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators without external logic.
  • Substantial Embedded Memory: Approximately 3.42 Mbits of on-chip RAM reduce dependence on external memory for buffering and enable higher system performance and lower latency.
  • High I/O Density: 624 I/O pins in a compact 1020-BBGA package simplify routing for wide buses and numerous peripherals.
  • Family-Level High‑Speed Serial Capability: Stratix GX transceiver features (CDR, SERDES, programmable equalization and VOD) enable support for common high-speed serial link standards and signal-integrity tuning.
  • Design Tool Integration: The Stratix GX family supports automated transceiver power-down and configuration features via vendor tools, helping manage power and speed trade-offs during development.
  • RoHS Compliance: Meets environmental manufacturing requirements for lead-free assembly and regulatory alignment.

Why Choose EP1SGX40DF1020C6?

The EP1SGX40DF1020C6 positions itself as a high-capacity, commercially rated Stratix GX FPGA option for designers who need a strong combination of logic density, embedded memory, and a very high I/O count in a compact BGA package. Its alignment with Stratix GX family transceiver capabilities and DSP resources makes it suitable for data‑intensive communications, networking, and signal-processing designs.

For teams building complex digital systems, this device offers a scalable platform with family-level features that support high-speed serial links and advanced clocking, while delivering the on-chip resources needed to reduce external BOM and simplify board-level integration.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for EP1SGX40DF1020C6.

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