EP1SGX40DF1020C6
| Part Description |
Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA |
|---|---|
| Quantity | 992 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 624 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 41250 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3423744 |
Overview of EP1SGX40DF1020C6 – Stratix® GX Field Programmable Gate Array (FPGA) IC 1020-BBGA
The EP1SGX40DF1020C6 is a Stratix® GX family FPGA from Intel, delivered in a 1020-BBGA (1020-FBGA, 33×33) package for surface-mount assembly. It combines a high-performance logic array with the Stratix GX family architecture that targets high-speed backplane interfaces, chip-to-chip links, and communications protocol-bridging applications.
This device provides a large logic capacity and substantial embedded memory alongside a high I/O count and commercial-grade operating range, offering a balanced platform for complex digital designs that require both logic density and high-speed serial capabilities as documented for the Stratix GX family.
Key Features
- Logic Capacity — 41,250 logic elements available for implementing complex digital functions and custom architectures.
- Embedded Memory — 3,423,744 bits of on-chip RAM (approximately 3.42 Mbits) for FIFOs, frame buffers, and local storage without reducing logic resources.
- I/O and Package — 624 user I/O pins in a 1020-BBGA package (supplier package: 1020-FBGA, 33×33), optimized for dense board-level integration and surface-mount assembly.
- Power and Supply — Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
- Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
- Stratix GX Transceiver Technology (Family-Level) — The Stratix GX family includes high-speed serial transceivers with clock-data recovery (CDR) and embedded SERDES supporting full-duplex operation from 500 Mbps up to 3.1875 Gbps, with programmable pre-emphasis, equalization, and per-channel power-down capability.
- DSP and Clocking Resources — Family documentation describes high-speed DSP blocks for multiply and multiply-accumulate functions and multiple PLL resources (up to eight general-use PLLs per device family) to support timing, spread-spectrum, and clock-multiplication needs.
- Compliance and Environment — RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- High‑Speed Networking Equipment — Implement backplane interfaces and protocol bridging where large logic arrays and high I/O count support packet processing and interface conversion.
- Chip‑to‑Chip and Board‑to‑Board Links — Use the Stratix GX family’s serial transceiver features for reliable high-speed serial communications between devices and modules.
- Communications Protocol Processing — Deploy for protocol adaptation and hardware-accelerated data handling in systems supporting Gigabit Ethernet, XAUI, SONET/SDH, and similar protocols (as documented for the Stratix GX family).
- High‑Performance DSP and Signal Processing — Leverage on-chip RAM and dedicated DSP resources for finite impulse response (FIR) filters, MAC operations, and real-time data processing.
Unique Advantages
- Large Logic Footprint: 41,250 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators without external logic.
- Substantial Embedded Memory: Approximately 3.42 Mbits of on-chip RAM reduce dependence on external memory for buffering and enable higher system performance and lower latency.
- High I/O Density: 624 I/O pins in a compact 1020-BBGA package simplify routing for wide buses and numerous peripherals.
- Family-Level High‑Speed Serial Capability: Stratix GX transceiver features (CDR, SERDES, programmable equalization and VOD) enable support for common high-speed serial link standards and signal-integrity tuning.
- Design Tool Integration: The Stratix GX family supports automated transceiver power-down and configuration features via vendor tools, helping manage power and speed trade-offs during development.
- RoHS Compliance: Meets environmental manufacturing requirements for lead-free assembly and regulatory alignment.
Why Choose EP1SGX40DF1020C6?
The EP1SGX40DF1020C6 positions itself as a high-capacity, commercially rated Stratix GX FPGA option for designers who need a strong combination of logic density, embedded memory, and a very high I/O count in a compact BGA package. Its alignment with Stratix GX family transceiver capabilities and DSP resources makes it suitable for data‑intensive communications, networking, and signal-processing designs.
For teams building complex digital systems, this device offers a scalable platform with family-level features that support high-speed serial links and advanced clocking, while delivering the on-chip resources needed to reduce external BOM and simplify board-level integration.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for EP1SGX40DF1020C6.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018