EP1SGX25FF1020I6N
| Part Description |
Stratix® GX Field Programmable Gate Array (FPGA) IC 607 1944576 25660 1020-BBGA, FCBGA |
|---|---|
| Quantity | 972 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA, FCBGA | Number of I/O | 607 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1SGX25FF1020I6N – Stratix® GX FPGA, 1020‑BBGA (FCBGA), Industrial Grade
The EP1SGX25FF1020I6N is a Stratix® GX Field Programmable Gate Array (FPGA) IC from Altera designed for applications that require substantial programmable logic, on‑chip memory, and a high I/O count. This industrial‑grade device integrates 25,660 logic elements and approximately 1.94 Mbits of embedded memory in a 1020‑BBGA (FCBGA) package.
Specified for surface‑mount board assembly with a 1.425 V to 1.575 V core supply and an operating temperature range of −40 °C to 100 °C, the device is suited to systems that require robust electrical and thermal operating margins.
Key Features
- Logic Resources 25,660 logic elements provide substantial programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 1.94 Mbits of on‑chip RAM to support data buffering, FIFOs, and state storage without external memory.
- I/O Count 607 available I/Os to enable broad connectivity and interface options on a single device.
- Package and Mounting 1020‑BBGA (FCBGA) supplier device package 1020‑FBGA (33×33) delivered in a surface‑mount form factor for compact board integration.
- Power Supply Core voltage range of 1.425 V to 1.575 V for defined power and timing characteristics.
- Temperature Grade Industrial operating range from −40 °C to 100 °C for deployment in temperature‑variable environments.
- Regulatory Compliance RoHS compliant to meet lead‑free manufacturing and environmental requirements.
Typical Applications
- High‑density digital systems Use where 25,660 logic elements and abundant I/O are needed to implement custom digital processing and glue logic.
- Embedded memory‑centric designs Systems that benefit from approximately 1.94 Mbits of on‑chip RAM for buffering, packet handling, or small data stores.
- Industrial control and automation Industrial‑grade temperature and surface‑mount packaging make the device suitable for control electronics and factory automation equipment.
Unique Advantages
- High integration density: 25,660 logic elements reduce the need for multiple discrete CPLDs or FPGAs, simplifying board design.
- Substantial on‑chip RAM: Approximately 1.94 Mbits of embedded memory enables local data storage and latency‑sensitive buffering without external memory.
- Extensive I/O availability: 607 I/Os provide flexibility to connect numerous peripherals, sensors, or high‑speed interfaces on a single device.
- Industrial temperature range: −40 °C to 100 °C operation supports deployment in thermally demanding environments.
- Industry‑standard packaging: The 1020‑BBGA (33×33) FCBGA footprint supports compact, high‑density PCB layouts.
- RoHS compliant: Meets lead‑free process requirements for modern manufacturing and environmental compliance.
Why Choose EP1SGX25FF1020I6N?
The EP1SGX25FF1020I6N balances large programmable logic capacity, significant embedded memory, and a high I/O count in an industrial‑rated Stratix® GX FPGA package. It is well suited for designers and engineers building complex digital systems, embedded controllers, or integration platforms that demand on‑chip resources and robust operating temperature margins.
Backed by Altera's Stratix® GX family heritage, this device provides a compact, RoHS‑compliant solution for designs requiring a combination of logic density, memory, and connectivity in a surface‑mount FCBGA form factor.
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