EP1SGX25DF672C7N

IC FPGA 455 I/O 672FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 455 1944576 25660 672-BBGA

Quantity 1,203 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O455Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1SGX25DF672C7N – Stratix® GX FPGA, 25,660 logic elements, 455 I/O, 672-BBGA

The EP1SGX25DF672C7N is a Stratix® GX family field-programmable gate array (FPGA) from Intel, optimized for high-performance, programmable logic and high-speed serial I/O. It delivers 25,660 logic elements and approximately 1.94 Mbits of on-chip RAM in a 672-ball BGA package, making it suitable for demanding communications, backplane and protocol-bridging designs.

Designed on the Stratix GX architecture, this device combines a high-density logic array with the family’s transceiver and SERDES capabilities and a 1.5-V logic technology operating from a 1.425 V to 1.575 V supply, enabling integration of complex, timing-critical functions within a single FPGA.

Key Features

  • Logic Capacity  25,660 logic elements for implementing mid-to-high complexity digital logic and state machines.
  • Embedded Memory  Approximately 1.94 Mbits of on-chip RAM to support packet buffering, FIFOs and on-chip data storage.
  • High-speed Transceivers (family capability)  Stratix GX family transceivers support 500 Mbps to 3.1875 Gbps full-duplex operation with clock data recovery (CDR) and embedded SERDES for protocol bridging and serial links.
  • I/O Density  455 I/O pins to interface with external memory, peripherals, and multi-lane serial PHYs.
  • Clocking and DSP Resources (family capability)  Dedicated DSP and PLL resources in the Stratix GX family provide hardware acceleration for multiply-accumulate and high-speed clock management tasks.
  • Package and Mounting  672-BBGA package (supplier device package listed as 672-FBGA (27x27)); surface-mount device for compact board-level integration.
  • Power and Supply  Core supply range 1.425 V to 1.575 V to match high-performance 1.5-V logic requirements.
  • Operating Range and Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • High-speed backplane interfaces  Use the device’s high-density logic and Stratix GX transceiver capabilities (family-level) to implement switched fabric and backplane protocol endpoints.
  • Chip-to-chip bridging  Implement protocol translation and SERDES-based links between ASICs, processors and other FPGAs using on-chip logic and embedded memory.
  • Communications protocol bridging  Support protocol adaptation and packet processing for interfaces such as Ethernet and Fibre Channel as part of network equipment designs (supported at the family level).
  • High-performance data buffering and processing  Leverage approximately 1.94 Mbits of embedded RAM and abundant logic elements for packet buffering, LUT-based preprocessing and custom data paths.

Unique Advantages

  • Balanced logic and memory  25,660 logic elements paired with ~1.94 Mbits of on-chip RAM enable complex control and data-path implementations without immediate reliance on external memory.
  • High I/O count  455 I/O pins give flexibility to connect wide parallel buses, multiple interfaces, or numerous serial lanes without extensive board-level multiplexing.
  • Family-level serial capability  Stratix GX transceiver technology (500 Mbps–3.1875 Gbps) supports high-speed serial links and protocol-aware features such as 8B/10B encoding and channel bonding.
  • Compact, production-ready packaging  672-ball BGA in a surface-mount form factor (supplier: 672-FBGA (27x27)) simplifies PCB routing density for space-constrained systems.
  • RoHS compliant  Environmentally compliant material status suitable for standard commercial production flows.

Why Choose EP1SGX25DF672C7N?

The EP1SGX25DF672C7N positions itself as a mid-to-high density Stratix GX FPGA option that combines substantial logic capacity and embedded RAM with a high I/O count and family-level high-speed transceiver features. It is well-suited for designers building communications equipment, backplane interfaces, protocol bridges, and other systems that require integrated serial and parallel processing in a single, RoHS-compliant device.

With commercial temperature rating, a 672-ball BGA package for dense board layouts, and a defined core supply range, this FPGA offers predictable integration characteristics and long-term design scalability within the Stratix GX family architecture.

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