EP1SGX25DF672C5N

The EP1SGX25DF672C5N is a Stratix® GX Field Programmable Gate Array (FPGA) from Altera in a 672-ball FCBGA package. It delivers a balanced combination of logic capacity, embedded memory, and high I/O count for commercial-grade embedded and system applications.

With 25,660 logic elements, approximately 1.94 Mbits of on-chip RAM and 455 user I/Os, this device is suited to designs that require substantial programmable logic and dense connectivity in a surface-mount, 672-FBGA (27×27) form factor.

Key Features

• Core Programmable Logic 25,660 logic elements provide the primary fabric for implementing custom digital functions and algorithm acceleration.
• Embedded Memory Approximately 1.94 Mbits of on-chip RAM to support data buffering, FIFOs and small lookup tables without external memory.
• High I/O Count 455 user I/Os enable dense external interfacing for parallel buses, sensors, and peripheral connectivity.
• Package & Mounting 672-BBGA (FCBGA) supplier device package (672-FBGA, 27×27) designed for surface-mount PCB assembly.
• Power Supported supply voltage range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Operating Conditions & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• High-density I/O systems — Use the 455 I/Os for board-level interface consolidation, parallel bus control, and sensor aggregation.
• Custom logic and prototyping — Implement complex state machines, protocol bridges, and hardware-accelerated algorithms using 25,660 logic elements.
• Embedded buffering and data staging — Leverage approximately 1.94 Mbits of on-chip RAM for temporary storage, packet buffering, and FIFO management.

Unique Advantages

• Significant logic capacity: 25,660 logic elements allow implementation of substantial custom logic without immediate reliance on external ASICs.
• On-chip memory for compact designs: Approximately 1.94 Mbits of embedded RAM reduce the need for external memory for many buffering and small-data-store use cases.
• High external connectivity: 455 user I/Os enable flexible interfacing to multiple peripherals and parallel data paths, simplifying board-level routing.
• Compact FCBGA package: 672-FBGA (27×27) provides a high-density, surface-mount footprint suitable for space-constrained PCBs.
• Predictable power requirements: Defined core supply range of 1.425 V to 1.575 V aids in power-supply selection and power budgeting.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for standard commercial applications.

Why Choose EP1SGX25DF672C5N?

The EP1SGX25DF672C5N positions itself as a commercial-grade FPGA that combines substantial programmable logic, embedded memory, and a large I/O complement in a compact 672-ball FCBGA package. It is appropriate for designs that require dense connectivity, moderate embedded storage, and tens of thousands of logic elements within a surface-mount solution.

Engineers and procurement teams seeking a RoHS-compliant FPGA with clearly defined supply-voltage and temperature constraints will find this device suitable for a range of embedded and system-level applications that match its published specifications.

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