EP1SGX25DF672C5

The EP1SGX25DF672C5 is an Intel Stratix® GX field-programmable gate array supplied in a 672-ball BGA package. It delivers a high-density logic array with extensive I/O and embedded memory, positioned for commercial applications that require scalable logic, substantial on-chip RAM, and broad interface support provided by the Stratix GX family architecture.

As a member of the Stratix GX family, the device is built around a high-performance logic fabric and transceiver-capable architecture designed for high-speed backplane, chip-to-chip, and communications protocol-bridging use cases.

Key Features

• Logic Capacity — 25,660 logic elements for implementing complex digital designs, with 2,566 LABs/CLBs available as part of the device fabric.
• Embedded Memory — Approximately 1.94 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage.
• I/O Density — 455 I/O pins to support broad peripheral, memory, and high-speed interface connectivity.
• High-speed Transceiver Family Features — Stratix GX family transceivers support 500 Mbps to 3.1875 Gbps per channel and are available in device variants offering 4 to 20 channels; features include clock data recovery (CDR), SERDES, programmable pre-emphasis/equalization, and protocol support from the Stratix GX series.
• Package and Mounting — Available in a 672-ball BGA (Supplier package: 672-FBGA, 27×27) for surface-mount assembly; package case noted as 672-BBGA.
• Power and Operating Range — Core supply range of 1.425 V to 1.575 V; commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High‑speed networking equipment — Use the device’s Stratix GX transceiver capabilities and large logic/memory resources for packet processing, bridging, and protocol conversion in networking line cards and switches.
• Backplane and board‑to‑board interfaces — Leverage the family’s high-speed serial channels and dense I/O to implement chip-to-chip links and backplane interconnects.
• Communications protocol bridging — Deploy the FPGA’s programmable fabric and embedded memory for protocol adaptation and timing alignment between diverse serial standards.
• High‑performance custom logic — Implement signal processing, control, and glue-logic functions that require a combination of abundant logic elements and on-chip RAM.

Unique Advantages

• Substantial logic and memory in one device: 25,660 logic elements combined with approximately 1.94 Mbits of embedded RAM reduce external component needs for many mid-to-high complexity designs.
• High I/O count: 455 I/Os enable flexible interfacing to multiple peripherals, memories, and external PHYs without additional I/O expanders.
• Family transceiver capability: Stratix GX family transceiver features support high-speed serial links and protocol-oriented features that simplify implementation of serial communications.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation, making it suitable for a wide range of commercial electronics applications.
• Industry-standard BGA packaging: 672-ball FBGA (27×27) provides a compact, manufacturable form factor for dense board designs.
• RoHS compliant: Enables use in lead-free manufacturing environments and aligns with common regulatory requirements.

Why Choose EP1SGX25DF672C5?

The EP1SGX25DF672C5 combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a surface-mount 672-ball BGA package, delivering a balanced FPGA platform for commercial communications, backplane, and custom logic applications. Its inclusion in the Stratix GX family brings access to high-speed serial transceiver features and a mature FPGA architecture.

This device suits design teams seeking a scalable, high-performance programmable solution with verifiable core supply and temperature specifications, and the physical packaging needed for dense, production-ready boards.

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