EP1SGX40DF1020C5
| Part Description |
Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA |
|---|---|
| Quantity | 781 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 624 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 41250 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3423744 |
Overview of EP1SGX40DF1020C5 – Stratix® GX Field Programmable Gate Array (FPGA), 1020-BBGA, 41,250 logic elements
The EP1SGX40DF1020C5 is a Stratix® GX family FPGA supplied in a 1020-BBGA package intended for commercial applications. It combines a high-density logic array with significant on-chip RAM and a large I/O count to address demanding communication and high-performance digital designs.
Built on the Stratix GX architecture, this device targets high-speed interfaces, protocol bridging and complex system logic where large logic capacity, embedded memory and high pin-count packaging are required.
Key Features
- High-density logic — 41,250 logic elements to implement complex custom logic, control and datapath functions.
- Embedded memory — approximately 3.42 Mbits of embedded memory (3,423,744 bits) for buffering, FIFOs and on-chip storage.
- Extensive I/O — 624 I/O pins for broad external interfacing and parallel connectivity.
- High-speed serial capability (family-level) — Stratix GX family transceivers support CDR and SERDES with data rates up to 3.1875 Gbps and common serial-protocol features, enabling high-speed backplane and chip-to-chip links.
- DSP and clocking resources (family-level) — high-speed DSP blocks and multiple PLLs provide hardware support for multiply-accumulate and advanced clocking architectures.
- Package and mounting — 1020-BBGA package (supplier package: 1020-FBGA, 33×33); surface-mount mounting for high-pin-count board designs.
- Power and thermal — specified supply range of 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
- Standards and development support (family-level) — family-level support for common interfaces and megafunction IP, including built-in 8B/10B encode/decode, pattern detection, and compatibility with Altera MegaCore and AMPP megafunctions.
- Compliance — RoHS compliant; commercial grade device.
Typical Applications
- High-speed networking and communications — Implement protocol bridging, packet processing and backplane interfaces leveraging the family's high-speed serial features and abundant logic resources.
- Chip-to-chip and board-level interconnects — Use the device's large I/O count and family-level SERDES capabilities to manage wide parallel and serial interfaces between components.
- Protocol conversion and protocol-aware processing — Combine dense logic and on-chip memory to implement data buffering, 8B/10B coding/decoding and alignment for protocol translation.
Unique Advantages
- Large logic capacity: 41,250 logic elements allow integration of complex state machines, datapaths and control logic into a single device, reducing system BOM.
- Substantial on-chip memory: Approximately 3.42 Mbits of embedded RAM supports deep buffering and FIFO requirements without relying on external memory.
- High I/O density: 624 I/O pins provide the connectivity needed for wide buses, multi-lane interfaces and dense board-level integration.
- High-speed serial support (family-level): Stratix GX transceiver technology supports multi-gigabit serial links and common link-layer features beneficial for communications designs.
- Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
- Flexible package for dense designs: 1020-BBGA / 1020-FBGA (33×33) footprint supports high pin-count applications while maintaining a compact board area.
Why Choose EP1SGX40DF1020C5?
EP1SGX40DF1020C5 positions itself as a high-capacity Stratix GX FPGA option for engineers who need substantial logic resources, significant embedded memory and a large I/O complement in a single commercial-grade package. It is suited to designs that combine complex programmable logic with high-speed interface requirements.
Combined with the Stratix GX family features—on-chip memory architectures, DSP resources, and serial-transceiver technology—this device offers designers a scalable platform supported by Altera MegaCore and AMPP megafunction IP for reduced development time and greater design flexibility.
If you would like pricing, availability or a formal quote for EP1SGX40DF1020C5, submit a request or contact the sales channel for current lead times and order options.

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