EP1SGX40DF1020I6N

IC FPGA 624 I/O 1020FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA

Quantity 631 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1SGX40DF1020I6N – Stratix® GX FPGA, 1020-BBGA, Industrial

The EP1SGX40DF1020I6N is an Intel Stratix® GX Field Programmable Gate Array (FPGA) supplied in a 1020‑BBGA package and specified for industrial temperature operation. It pairs a high-performance logic array with family-level high-speed serial transceiver capabilities and on-chip memory to address demanding communications, backplane, and protocol-bridging designs.

This device provides a scalable logic resource set and embedded memory alongside a large I/O count and a 1.425–1.575 V core supply range, enabling integration of complex logic, DSP functions, and high-speed interfaces in space-efficient surface-mount BGA packaging.

Key Features

  • Logic Capacity — 41,250 logic elements and 4,125 logic array blocks (LABs) for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 3.42 Mbits of on-chip RAM (3,423,744 bits) with TriMatrix memory architecture supporting multiple RAM block sizes for dual-port memory and FIFO implementations.
  • High-speed Transceiver Technology (family) — Stratix GX family transceivers support clock-data recovery and serial rates up to 3.1875 Gbps, programmable pre-emphasis/equalization, 8B/10B encode/decode, and built-in test and channel management features as described for the family.
  • I/O and Interface Flexibility — 624 user I/O pins, with support for numerous single-ended and differential standards and high-speed source-synchronous differential I/O capabilities (family-level support).
  • Dedicated DSP and Clock Resources (family) — High-speed DSP blocks for multiplier and MAC implementations and up to eight general-purpose PLLs providing spread spectrum, bandwidth control, and clock phase adjustment (family-level features).
  • Power and Packaging — Surface-mount 1020‑BBGA (supplier package 1020‑FBGA, 33×33) with a core voltage supply range of 1.425 V to 1.575 V.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial applications.
  • Compliance — RoHS compliant.

Typical Applications

  • High-speed Communications — Use the Stratix GX transceiver features and on-chip memory to implement protocol bridging, aggregation, and line-side functions that require serial links up to 3.1875 Gbps (family-level capability).
  • Backplane and Chip-to-Chip Interfaces — Large logic capacity and abundant I/O (624 pins) enable complex backplane controllers and chip-to-chip interface implementations.
  • DSP and Signal Processing — On-chip DSP blocks and substantial embedded RAM support multiply-accumulate and FIR filter workloads common in network processing and embedded signal chains (family-level DSP resources).
  • High-performance System Control — Combine high logic density and flexible I/O to implement system supervisory functions, custom peripherals, and protocol converters in industrial equipment.

Unique Advantages

  • Large Logic Resource Pool: 41,250 logic elements provide headroom for complex state machines, custom accelerators, and system integration within a single device.
  • Significant Embedded Memory: Approximately 3.42 Mbits of on-chip RAM reduces external memory dependence for buffering, FIFOs, and small data stores.
  • High I/O Count: 624 I/O pins support wide parallel buses and numerous peripheral connections without additional multiplexing hardware.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C and RoHS compliance suit industrial product lifecycles and environmental requirements.
  • Compact BGA Packaging: 1020‑BBGA (33×33) surface-mount package enables high-density board designs while preserving substantial integration capabilities.
  • Family-level High-speed Serial Support: Stratix GX family transceiver features—including CDR and programmable signal conditioning—facilitate robust serial link implementations where required.

Why Choose EP1SGX40DF1020I6N?

The EP1SGX40DF1020I6N balances high logic capacity, on-chip memory, and a large I/O complement in a compact 1020‑BBGA package rated for industrial temperatures. It is well suited for engineers who need to integrate complex logic, DSP functions, and multiple high-speed interfaces on a single FPGA platform derived from the Stratix GX family architecture.

For designs that require scalability and established family-level transceiver and memory architectures, this device offers a clear path to consolidating functions, reducing external components, and supporting demanding communications and control applications.

Request a quote or submit an inquiry to check availability and pricing for EP1SGX40DF1020I6N. Our team can provide lead-time and ordering information to support your design schedule.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up