EP1SGX40GF1020C6

IC FPGA 624 I/O 1020FBGA
Part Description

Stratix® GX Field Programmable Gate Array (FPGA) IC 624 3423744 41250 1020-BBGA

Quantity 427 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O624Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1SGX40GF1020C6 – Stratix® GX Field Programmable Gate Array (FPGA) IC 624 I/Os, ~3.42 Mbits RAM, 41,250 LEs, 1020-BBGA

The EP1SGX40GF1020C6 is a commercial-grade Stratix® GX series FPGA offering a high-performance logic array and extensive I/O in a 1020-BBGA package. Built on the Stratix architecture, the device targets applications that require large logic capacity, substantial embedded memory, and rich I/O connectivity.

With 41,250 logic elements, approximately 3.42 Mbits of embedded memory, and 624 I/O pins, this FPGA is suited for high-speed communications, protocol bridging, and complex system integration where programmable logic and high I/O density are required.

Key Features

  • Logic Capacity  41,250 logic elements provide substantial programmable logic resources for complex designs and system-level integration.
  • On‑Chip Memory  Approximately 3.42 Mbits of embedded RAM support large buffers, FIFOs, and memory-intensive functions without reducing logic resources.
  • I/O Density  624 I/O pins enable wide external interfacing, high channel counts, and extensive board connectivity.
  • High‑Speed Transceiver Technology (family)  Stratix GX family devices integrate high-speed serial transceivers with clock data recovery and embedded SERDES, supporting full‑duplex operation from 500 Mbps to 3.1875 Gbps and common serial protocols.
  • Programmable Transceiver Controls (family)  Programmable VOD, pre‑emphasis, and equalization along with per‑channel power‑down and transceiver-to-FPGA interface width control help optimize signal integrity and power use.
  • DSP and Clocking (family)  High‑speed DSP blocks for multipliers and MAC functions and up to eight general-purpose PLLs (including enhanced and fast PLLs) offer flexible clocking, spread spectrum, and real‑time PLL reconfiguration.
  • Memory Architecture (family)  TriMatrix™ memory with three RAM block sizes supports true dual-port memories and FIFO buffering for efficient dataflow implementation.
  • Package & Mounting  1020-BBGA (supplier package: 1020‑FBGA, 33×33) in a surface-mount form factor for compact board integration.
  • Power and Temperature  Core supply range 1.425 V to 1.575 V and commercial operating temperature range 0 °C to 85 °C.
  • Standards & Test Features (family)  Built-in self test (BIST), pattern detection, 8B/10B encode/decode, and channel bonding support common in high-speed serial applications.
  • Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • High‑speed communications  Deploy protocol bridging and backplane interfaces that leverage the Stratix GX transceiver capabilities and on‑chip memory for buffering and packet handling.
  • Chip‑to‑chip interfaces  Use the device’s high I/O count and transceiver features to implement wide data buses and serialized links between FPGA and ASIC or processor subsystems.
  • Networking equipment  Implement MAC/PHY bridging, packet processing, and timing-critical data paths using the device’s DSP blocks, PLLs, and large logic-memory balance.
  • High‑performance prototyping  Leverage the large logic capacity and abundant I/O for system prototyping, emulation of complex functions, or proof-of-concept implementations.

Unique Advantages

  • Substantial programmable fabric:  41,250 logic elements provide the capacity to integrate multiple system functions into a single device, reducing board-level components.
  • Significant on‑chip memory:  Approximately 3.42 Mbits of embedded RAM enable large FIFOs and buffering without external memory for many applications.
  • High I/O count:  624 I/O pins support broad external connectivity and simplify routing for multi‑channel systems.
  • High‑speed serial support (family):  Integrated transceiver technology with programmable equalization and CDR simplifies implementation of multi‑Gbps links and standard serial protocols.
  • Flexible clocking and DSP resources (family):  Multiple PLLs and dedicated DSP blocks allow precise timing control and efficient implementation of signal processing tasks.
  • Space‑efficient package:  1020‑BBGA (33×33) surface-mount package delivers high density in a compact footprint for modern PCB designs.

Why Choose EP1SGX40GF1020C6?

The EP1SGX40GF1020C6 combines a large Stratix GX logic array with substantial embedded memory and high I/O density in a compact 1020‑BBGA package. These attributes make it well suited for designs that need significant programmable logic, on‑chip buffering, and extensive external interfacing within a commercial temperature range.

Customers designing communications, protocol-bridging, or high‑performance prototyping systems can use this device to consolidate functionality, manage high data rates with family transceiver features, and take advantage of flexible clocking and DSP resources for signal processing tasks. RoHS compliance and surface-mount packaging simplify manufacturing and deployment.

If you require pricing, availability, or a formal quote for EP1SGX40GF1020C6, request a quote or submit a purchase inquiry and our team will respond with next steps.

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