EP1SGX10DF672C7

The EP1SGX10DF672C7 is a Stratix® GX family FPGA offered in a 672-ball BGA package for surface-mount applications. It provides 10,570 logic elements and approximately 0.92 Mbits of embedded memory, combined with 362 general-purpose I/O pins and a 1.425 V to 1.575 V core supply range for commercial-temperature designs.

Built on the Stratix GX architecture, the family includes high-speed serial transceiver technology and a scalable, high-performance logic array, making this device suitable for high-speed backplane interfaces, chip-to-chip bridging, and communications protocol applications.

Key Features

• Core Logic  10,570 logic elements provide programmable logic density for mid-range FPGA designs.
• Embedded Memory  Approximately 0.92 Mbits of on-chip RAM to implement buffers, FIFOs, and dual-port memory structures.
• High-Speed I/O  362 I/O pins support a wide range of external interfaces and board-level connectivity.
• Transceiver Capabilities (Family)  Stratix GX family devices include high-speed serial transceivers with clock-data recovery and SERDES support from 500 Mbps to 3.1875 Gbps, enabling protocol-bridging and high-bandwidth links (series-level feature).
• Package & Mounting  672-ball BGA (supplier package listed as 672-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Power  Nominal core supply range of 1.425 V to 1.575 V for the FPGA core.
• Operating Range & Compliance  Commercial-grade operation from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• High-Speed Backplane Interfaces  Use the Stratix GX architecture and series transceiver capabilities for board-to-board and backplane communication links.
• Chip-to-Chip Interconnect  Deploy the device for protocol bridging and high-bandwidth chip-to-chip data paths using the FPGA’s logic and I/O resources.
• Communications Equipment  Implement packet processing, protocol adaptation, and serial link functions leveraging on-chip RAM and logic density.
• Protocol Bridging  Leverage series-level transceiver features and flexible I/O to translate between disparate interface standards in system designs.

Unique Advantages

• Balanced Logic and Memory:  10,570 logic elements combined with approximately 0.92 Mbits of embedded RAM give designers the flexibility to implement mid-range logic functions with substantial on-chip buffering.
• High I/O Count:  362 I/O pins enable complex board-level interconnect and multiple parallel interfaces without external I/O expanders.
• Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
• Compact Ball-Grid Package:  672-BBGA (27×27) provides a high-density, surface-mount footprint for space-constrained PCBs.
• Scalable Family Capabilities:  As part of the Stratix GX family, designers can access high-speed serial transceiver capabilities and family-level megafunctions when scaling designs.

Why Choose EP1SGX10DF672C7?

The EP1SGX10DF672C7 combines mid-range logic capacity, significant embedded memory, and a high I/O count in a compact 672-BBGA package, making it well suited for communications-focused and interface-intensive designs. Its commercial temperature rating and RoHS compliance align it with standard production environments where performance and manufacturability are key.

Leveraging the Stratix GX family architecture allows designers to take advantage of series-level high-speed transceiver technology and a mature ecosystem for protocol bridging and high-bandwidth applications while keeping system BOM and board area under control.

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